The research community is experiencing a revolution in microscale and nanoscale heat transfer, with a focus on developing fundamental experiments and theoretical techniques. More recently, these advancements have begun to influence the design of electronic systems. A futuristic electronic cooling solution might include high efficiency thermoelectric devices made from nanomaterials for the cooli...

Vapor-venting microchannel heat exchangers are promising because they address the problems of high pressure drop, flow instability, and local dryout that are common in conventional two-phase microchannel heat sinks. We present a 3D numerical simulation of the vapor-venting process in a rectangular microchannel bounded on one side by a hydrophobic porous membrane for phase-separation. The simula...

Photovoltaic power generation is a growing renewable primary energy source, expected to assume a major role as we strive toward fossil fuel free energy production. However, the photovoltaic efficiencies limit the conversion of solar radiation into useful power output. Hybrid systems extend the functionality of concentrating photovoltaics (CPV) from simply generating electricity, to providing si...

Power semiconductors can be modeled as a thermal network of resistors and capacitors. The thermal boundary condition of such a model is typically defined as the heat sink surface temperature which is assumed to be constant. In reality, the heat sink surface temperature underneath the power module is not exactly known. In this paper we show how to set up a thermal model of the heat sink in form ...

This paper describes the heat and mass transfer in a square microchannel that is heated from one side. This microchannel represents a reaction channel in a microreactor that is used to study the kinetics of the catalytic partial oxidation of methane. The microchannel is contained in a silicon wafer and is covered by a thin silicon sheet. At the top side of this sheet, heating elements are prese...

Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as “hot spots”. The current air cooling technologies present diminishing returns, thus it is strategically important for the microelectronics industry to establish the research and develo...