The control of electronic and thermal transport through material interfaces is crucial for numerous micro and nanoelectronics applications and quantum devices. Here we report on the engineering of the electro-thermal properties of semiconductor-superconductor (Sm-S) electronic cooler junctions by a nanoscale insulating tunnel barrier introduced between the Sm and S electrodes. Unexpectedly, suc...

Because interfaces impede phonon transport of thermal energy, nanostructuring can transform fully dense solids into ultralow thermal conductivity materials. Here we report a simple self-assembly approach to synthesizing organoclay nanolaminates with cross-planar thermal conductivities below 0.10 W m(-1) K(-1)-a 5-fold decrease compared to unmodified clay. These organoclays are produced via alky...

Due to rapidly increasing power densities in nanoelectronics, efficient heat removal has become one of the most critical issues in thermal management and nanocircuit design. In this study, we report a surface nanoengineering design that can reduce the interfacial thermal resistance between graphene and copper substrate by 17%. Contrary to the conventional view that a rough surface tends to give...

The reliability of microelectronic devices is largely dependent on electronic packaging, which includes heat removal. The appropriate packaging design therefore necessitates precise knowledge of the relevant material properties, including thermal resistance and thermal conductivity. Thin materials and high conductivity layers make their thermal characterization challenging. A steady state measu...

The isochoric thermal conductivity of solid C6H6 is described within a model in which the heat is transferred by phonons and above the phonon mobility edge by “diffusive” modes migrating randomly from site to site. The mobility edge ω0 is found from the condition, that the phonon mean-free path restricted by the examined mechanisms of scattering cannot become smaller than half the wavelength. T...

Chip scale package (CSP) technology offers promising solutions to package power device due to its relatively good thermal performance among other factors. Solder thermal interface materials (STIMs) are often employed at the die bond layer of a chip-scale packaged power device to enhance heat transfer from the chip to the heat spreader. Nonetheless, the presence of voids in the solder die-attach...

Network Identification by Deconvolution (NID) method is applied to the analysis of the thermal transient pulsed laser heating. This is the excitation used in many optical experiments such as the Pump-Probe Transient Thermoreflectance experiment. NID method is based on linear RC network theory using Fourier’s law of heat conduction. This approach is used to extract the thermal time constant spec...

An extensive study of the one-dimensional two-segment Frenkel-Kontorova (FK) model reveals a transition from the counterintuitive existence to the ordinary nonexistence of a negative-differential-thermal-resistance (NDTR) regime, when the system size or the intersegment coupling constant increases to a critical value. A "phase" diagram which depicts the relevant conditions for the exhibition of...

A thermal bridge is a part of the building envelope where the otherwise uniform thermal resistance is significantly changed by: • Full or partial penetration of the building envelope by materials with a different thermal conductivity and/or • A change in thickness of the structure and/or • A difference between internal and external areas, such as occur at wall-floor-ceiling junctions. INTRODUCT...