In this paper, the development of wafer bonding techniques of the most frequently used materials Si-to-glass, glass-to-glass and Si-to-Si is reported. To improve the bond quality of Si-to-glass and make glass-to-glass bonding viable at bonding temperatures less than 300 C, a hydrogen-free amorphous silicon layer of 20-100 nm thickness is deposited as an intermediate layer. For Si-to-glass bondi...

An anisotropic conductive adhesive (ACA) bump was produced on a silicon chip for bonding onto a glass substrate. The bumping process and the bonding procedure are described. The constituents of the ACA were investigated with a scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The thermal behavior of the ACA was investigated with differential scanning calorimetry (DSC)...

This article discusses a method of wafer-to-wafer bonding using metallic copper as the bonding medium. This method is commonly known as thermo-compression bonding. Bonding process is described and characterization results are presented. Reliability issues related to voids formation in the bonded layer is discussed. A survey on progress of copper-based wafer bonding and its application for 3-D I...

The judgment of metal rod buffer system bonding quality depends on the bond of the metal rods with the surrounding medium. System bonding area will lead to different reflection amplitude. Compared the simulation with the experiment, it can be concluded that different bonding area can measure bond quality, i.e, the greater the bonding area is the more excellent bonding quality will be. This conc...

An array of inverted InGaAs metal–semiconductor–metal (MSM) photodetectors has been integrated into a silicon substrate using a low temperature In–Au wafer bonding technique. The total thickness of the bonding metal layers is less than 1 mm. It is shown that the photocurrent of the back illuminated InGaAs MSM photodetectors after bonding increases by 70% compared to the front illuminated MSM me...

We present here the capillary cohesion resulting from a liquid bridge between two particles. The bridge between two particles of different sizes takes a complex shape as illustrated in figure 1. R1 and R2 are the particle radii, ζ1 and ζ2 are the filling angles (corresponding to the wetted surface of the particles), θ is the wetting angle, and δn is the distance between particles. The axis x co...

An in vitro study was conducted to evaluate the accuracy of bracket placement for direct and indirect bonding techniques. Nineteen sets of duplicated Class II malocclusion models were divided into three groups: (1) one set for ideal bracket placement, (2) nine sets for direct bonding on mannequins, and (3) nine sets for indirect bonding. Both direct and indirect bonding were performed on all te...

BACKGROUND Previous research has suggested that extraordinary adverse experiences during childhood, such as abuse, are possible risk factors for the development of chronic pain. However, the relationship between the perceived parental bonding style during childhood and chronic pain has been much less studied. METHODS In this cross-sectional study, 760 community-dwelling Japanese adults were a...

Background and Aim: This study aimed to evaluate the effect of repeated bonding by self-etching primers (SEPs) and a conventional phosphoric acid-etchant on shear bond strength (SBS), adhesive remnant index (ARI), and enamel morphology at different debonding time points. Materials and Methods: In this experimental study, 120 premolars were randomly divided into six groups of 20. In the first t...

Au-Sn solid–liquid interdiffusion (SLID) bonding is a novel and promising interconnect technology for high-temperature applications. This article gives a review over previously published work on Au-Sn SLID bonding. An overview of the crystal phases and the thermomechanical properties of the Au-Sn phases relevant for Au-Sn SLID bonding is given. A summary of the bonding conditions used during Au...