In present-day high-performance electronic components, the generated heat loads result in unacceptably high junction temperatures and reduced component lifetimes. Thermoelectric modules can, in principle, enhance heat removal and reduce the temperatures of such electronic devices. However, state-of-the-art bulk thermoelectric modules have a maximum cooling flux qmax of only about 10 W cm(-2), w...

Upon cooling, a thin metal film deposited on compliant elastomer substrate undergoes equi-biaxial compression and begins to buckle at a critical stress. As further cooling occurs, a highly ordered herringbone pattern self-assembles. The preference for the herringbone pattern over other potential modes is demonstrated based on minimum energy arguments. Control of the pre-buckling in-plane stress...

Direct numerical simulations are used to investigate the method of film cooling in a laminar flat-plate Mach-2.67 boundary layer. Air is employed as mean-flow and coolant gas and is introduced into the boundary layer through one row of holes by means of a modeled blowing approach. The effects of a favorable streamwise pressure gradient are investigated for two different blowing rates and an adi...

A new finite volume algorithm has been developed to solve a variety of flows by using large eddy simulation and direct numerical simulation. This finite volume algorithm was developed using a dual time stepping approach with a preconditioning technique and a new factorization implementation. The method takes the advantage of pressure-based and density-based meth­ ods. Thus, it provides an effic...

Thin liquid wall fillTIs flowing under the influence of high-velocity turbulent gas streaIllS were studied for the purpose of obtaining an understanding of the Illechanics of filIll cooling. Conditions which insure liquid-filIll attachIllent to solid surfaces without loss of unevaporated liquid to the gas streaIll when siIllple radial-hole injectors are used were found; the IllaxiIlluIll allowa...

1 Contact author e-mail: [email protected] ABSTRACT A 3D electrothermal model is used to simulate and optimize Si/SiGe superlattice heterostructure micro-coolers. The model considers thermoelectric/thermionic cooling, heat conduction and Joule heating. It also includes non-ideal effects, such as contact resistance between metal and semiconductor, substrate/heatsink thermal resistance, the side c...

The solidification of two-dimensional liquid silicon confined to a slit nanopore has been studied using molecular dynamics simulations. The results clearly show that the system undergoes an obvious transition from liquid to multilayer hexagonal film with the decrease of temperature, accompanied by dramatic change in potential energy, atomic volume, coordination number and lateral radial distrib...