0167-9317/$ see front matter 2010 Elsevier B.V. A doi:10.1016/j.mee.2010.08.001 ⇑ Corresponding author. E-mail address: [email protected] (J. Kanick We report on the effects of back channel etch depth and etchant chemistry on the electrical characteristics of inverted staggered advanced amorphous silicon thin-film transistors. We found that the optimum amorphous silicon film thickness in t...

The aim of this study was to compare the bond strength of translucent fiber posts to root dentin, cemented with 4 adhesion strategies. Forty eight (48) sound human central incisors were decoronated and divided into 4 groups: Etch-and-rinse group, two-step self-etch group, one-step self-etch group, and self-adhesive resin cement group. The adhesion between the post and root canal walls was asses...

A quantitative model capturing pattern dependent effects and time evolution of the etch rate in Deep Reactive Ion Etching (DRIE) is presented. DRIE is a key process for pattern formation in semiconductor fabrication. Non-uniformities are caused due to microloading and aspect ratio dependencies. The etch rate varies over time and lateral etch consumes some of the etching species. This thesis con...

In MEMS fabrication micro-mechanical components have to be partially released from a substrate. Selectively etching away sacrificial layers, such that a free standing structure remains, is a widely used technique for this purpose. Free standing structures allow MEMS devices to induce or to sense mechanical movements or vibrations. During sacrificial etching lower etch rates than the blanket one...

Introduction The aim of this study was to evaluate marginal sealing ability of newly introduced Dyad Flow flowable composite and compare to total-etch and self-etch adhesive system at the coronal and apical margins of class V resin composite restorations. Material and Methods A standard class V cavity (3 mm mesiodistal width, 3 mm occlusogingival height and 1.5 mm axial depth) was prepared on t...

The chemical dry etching of silicon nitride (Si3N4)and silicon nitride (SiO2) in a downstream plasma reactor using CF4, O2, and N2 has been investigated. A comparison of the Si3N4 and SiO2 etch rates with that of polycrystalline silicon shows that the etch rates of Si3N4 and SiO2 are not limited by the amount of fluorine arriving on the surface only. Adding N2 in small amounts to a CF4 /O2 micr...

As frequently added to adhesives, the mono-functional monomer 2-hydroxyethyl methacrylate (HEMA) acts as co-solvent and improves surface wetting. Nevertheless, HEMA promotes watersorption hydrolysis at adhesive interfaces, affecting bond durability dentin. This study investigated if two acrylamide co-monomer alternatives could replace in experimental adhesive-resin formulations part of 3/2-step...

STATEMENT OF THE PROBLEM Composite bond to dentin is crucial in many clinical conditions particularly in deep cavities without enamel margins due to insufficient penetration of adhesive into demineralized dentin. PURPOSE The aim of this study was to assess the shear bond strength (SBS) of a methacrylate-based and a silorane-based composite resin to surface and deep dentin after pretreatment w...

BACKGROUND This study was carried out to evaluate the nanoleakage of two types of nanofilled adhesive systems in Class V composite resin restorations. MATERIALS AND METHODS Totally 60 human premolars were randomly assigned to two groups (n = 30). Standardized round Class V cavities (enamel and dentin margins) were prepared. A total-etch (N-Bond total etch) (Ivoclar Vivadent) and self-etching ...

Background: Restoring bonding composite to silver diamine fluoride (SDF)-treated enamel is challenging. This study investigates if phosphoric acid etch restores bond strength SDF-treated using universal adhesives. Methods: Twenty-four recently extracted permanent teeth were randomly divided into 4 (2 experimental (SDF) and 2 control (CTR)) groups: SDF+Water: SDF (1 min) then water rinse (15 mL)...