at the final stages of a coronary artery bypass graft operation on a 64-year-old man, an experienced physician attempted to insert an intra-aortic balloon pump into the femoral artery via the seldinger technique. however, while the balloon pump was being passed over the guide wire, the latter was completely lost. the guide wire should be held at the tip at all times to prevent passage into the ...

The paper presents a design of a W-band planar accelerating structure (muffin tin) [1]. The structure is a 2 /3-mode traveling wave, constant impedance structure with an operating frequency of 91.392 GHz. The design includes a new power coupler and a cavity geometry optimized for high shunt impedance. A 7–cell cold test prototype has been fabricated by wire electro discharge machining. Measurem...

A new magnetic resonance imaging (MRI)-compatible positron emission tomography (PET) detector design is being developed that uses electro-optical coupling to bring the amplitude and arrival time information of high-speed PET detector scintillation pulses out of an MRI system. The electro-optical coupling technology consists of a magnetically insensitive photodetector output signal connected to ...

in this paper, scattering of a plane and monochromatic electromagnetic wave from a nano-wire is simulated using surface integral equations. first, integral equationsgoverning unknown fields on the surface is obtained based on stratton-cho surface integral equations. then, the interaction of the wave with a non-plasmonic as well as a palsmonic nano-wire is considered. it is shown that in scatter...

central venous catheterization (cvc) is a commonly performed procedure for venous access. it is associated with several complications. we report a rare case of extra luminal entrapment of guide wire during cvc placement in right jugular vein. we report a case of 28 years old female patient presented in our emergency with history of entrapped guide wire in right side of neck during cvc. x-ray sh...

Due to their excellent physical and mechanical properties, third-generation super-hard semiconductor materials (such as SiC, GaN) are used widely in the field of microelectronics. However, due its ultra-high hardness, machining is very difficult, which has become bottleneck development. Slicing first procedure that directly affects subsequent process. Fixed abrasive diamond wire saw (DWS) been ...