0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...

Copper (Cu) could be suitable to create anti-infective implants based on Titanium (Ti), for example by incorporating Cu into the implant surface using plasma immersion ion implantation (Cu-PIII). The cytotoxicity of Cu might be circumvented by an additional cell-adhesive plasma polymerized allylamine film (PPAAm). Thus, this study aimed to examine in vivo local inflammatory reactions for Ti6Al4...

The interaction of ultrathin fdms of Cu with Rh(100) and Ru(0001) has been examined by using X-ray photoelectron spectrapcopy (XPS). The effects of surface annealing temperature, adsorbate coverage (film thickness), and CO chemisorption were investigated. The XPS data show that the atoms in a monolayer of Cu supported on Rh( 100) or Ru(0001) are electronically perturbed with respect to the surf...

The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermocompression bonded dice at 10μm and 15μm pitch in large area arrays are shown. The interconnect bonding process pressure and temperature required for the formation of low resistance (<100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. In the case of Cu/Sn-Cu, use of a m...

The reduction of Cu(II) oxide species in siliceous matrixes of different porosity (MFI, FAU, MCM-48) and in alumosilicate MFI was studied by temperature-programmed reduction in hydrogen (TPR), by X-ray absorption fine structure (after stationary hydrogen treatments), and by transmission electron microscopy. It was found that the reduction may proceed in one or in two reduction steps. The two-st...

64Cu accumulation and total Cu concentrations were measured in gill filaments, plasma, liver and bile of fed and starved European eels (Anguilla anguilla) during 28 days of exposure to 12 and 94 micrograms Cu l-1. Branchial Cu uptake was found to be 0.03 and 0.13 microgram Cu g gill filament-1 h-1 at 12 and 94 micrograms Cu l-1, respectively, throughout 28 days of Cu exposure. At least during e...

Plastocyanin, which requires copper (Cu) as a cofactor, is an electron carrier in the thylakoid lumen and essential for photoautotrophic growth of plants. The Cu microRNAs, which are expressed during Cu deprivation, down-regulate several transcripts that encode for Cu proteins. Since plastocyanin is not targeted by the Cu microRNAs, a cofactor economy model has been proposed in which plants pri...

New highly mixed phases have been identified in Cu/ZnO systems by EXAFS and XANES at both the Cu and Zn K-edge. The phases were generated by ball-milling Cu(2)O/ZnO mixtures under three different atmospheres of synthetic air (SA), SA + CO(2) and CO(2). The system milled in CO(2) shows disproportionation of Cu(2)O into Cu(0), Cu(1+) (cuprite Cu(2)O-type phase) and Cu(2+) (tenorite CuO-type phase...

In the title compound, [Cu(3)I(3)(C(5)H(5)NS)(3)](n), a polymeric structure is formed along [100] through bridging iodide and pyridine-2-thione ligands. The metal atoms are engaged in [Cu(3)S(3)] and [Cu(2)S(2)] rings sharing Cu-S edges, with the [Cu(2)S(2)] rings located about inversion centers. Cu(I) atoms bridged by iodide ions exhibit the shortest Cu⋯Cu separation in the polymer [2.8590 (14...

BACKGROUND Diamine oxidase (DAO) is a polyamine-degrading enzyme also implicated in histamine metabolism. Chronic urticaria (CU) has a wide spectrum of clinical presentations and causes. Anisakis sensitisation associated chronic urticaria (CU+) has been characterised as a phenotype with different clinical and immunological characteristics and possibly associated with previous acute parasitism. ...