نتایج جستجو برای: cause shock failure
تعداد نتایج: 820922 فیلتر نتایج به سال:
Measurement errors and other uncertainties place an interval of ambiguity around the mean value of system probability of failure and each path and component failure probability. Associated with a specified reliability R that a failure probability will lie within an interval is a confidence C in that reliability. The statement that the system probability of failure lies within a specified interv...
A reliable prognostics framework is essential to address failure mode mitigation and life cycle cost of aerospace systems. Metallic aircraft components are subject to a variety of inservice loading conditions and prediction of fatigue life remains a critical challenge. A hybrid prognostic model, which can accurately predict the crack growth regime and the residual useful life estimate (RULE) of...
Article history: Received 22 May 2015 Received in revised form 15 June 2015 Accepted 23 June 2015 Available online xxxx GaN-based LEDs often use polymermaterial as chip coating. The most used polymer coatings are siloxane-based materials such as poly(methyl-phenyl-silixane) – PMPS – or poly(dimethylsiloxane) — PDMS. Although their thermal properties offer great possibilities to justify their in...
In this paper, we develop reliability and conditionbased maintenance models for a multi-component system of stents implanted in human arteries that is subject to both delayed and instantaneous failures. Considering the physics of failure and probability of failure, we develop a system-level reliability model and maintenance strategy by merging fracture mechanics and stochastic process approache...
Reliability Evaluation of Underfill Encapsulated Pb- Free Flip Chip Package under Thermal Shock Test
Thermo-mechanical reliability of the solder bumped flip chip packages having underfill encapsulant was evaluated with thermal shock testing. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 IMC layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. ...
The paper analyses possible types, shapes and locations of defects in a life cycle according to such factors of a urea reactor as material, structure, manufacture approach, work environment, operating medium and failure mode. Then suitable nondestructive testing methods are chosen to test a urea reactor on service on the basis of characteristics of various nondestructive testing methods. And te...
Abstract: The paper illustrates the results of experimental tests performed on sub-assemblages of R/C (Reinforced Concrete) existing structures, designed only for gravity loads In order to estimate failure mechanisms and ductility properties, four internal and external R/C beam-column joints were built and tested. The specimens were built by using concrete with low strength and smooth reinforci...
Warranty claims and supplementary data contain useful information about product quality and reliability. Analysing such data can therefore be of benefit to manufacturers in identifying early warnings of abnormalities in their products, providing useful information about failure modes to aid design modification, estimating product reliability for deciding on warranty policy and forecasting futur...
Usually the warranty data response used to make predictions of future failures is the number of weeks (or another unit of real time) in service. Use-rate information usually is not available (automobile warranty data are an exception, where both weeks in service and number of miles driven are available for units returned for warranty repair). With new technology, however, sensors and smart chip...
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