The modern integrated circuit is one of the most complex products that has been engineered to-date. It continues to grow in complexity as the years progress. As a result, very large-scale integrated (VLSI) circuit design now involves massive design teams employing state-of-the art computer-aided design (CAD) tools. One of the oldest, yet most important CAD problems for VLSI circuits is physical...

Two-dimensional transition metal dichalcogenides (TMDCs) demonstrate great potential in nanoelectronics devices owing to their high carrier mobility the atomically thin channel regime. However, contact resistance between source/drain electrodes and TMDC channels hinders TMDCs applications very-large-scale integration (VLSI) field. Here, this work reports aligned van der Waals (vdW) junction fab...

Solid Freeform Fabrication, SFF, is a set of manufacturing processes that fabricates parts as a bonded stack of individual layers. The Three Dimensional Printing process, 3DPTM process, is an SFF technology developed at MIT. It builds layers by ink jet printing binder onto the surface of a bed of powder. The bed of powder is lowered and fresh powder is spread onto the bed. As subsequent cross s...

Bibliography 95 Introduction In 1943, Thomas Watson, founder of IBM, remarked that he thought that there was a \ w orld market for maybe ve computers." In 1949, the American magazine \Popular mechanics" reported optimistically that computers in the future might weigh no more than 1.5 tons. In 1977, Ken Olsen, founder of Digital Equipment, scooed that \there is no reason anyone wants a computer ...

in this paper an application of cellular learning automata (cla) to vlsi placement is presented. the cla, which is introduced for the first time in this paper, is different from standard cellular learning automata in two respects. it has input and the cell neighborhood varies during the operation of cla. the proposed cla based algorithm for vlsi placement is tested on number of placement proble...

I 'HE currents present in VLSI conI ductor patterns are responsible for two major problems: Electromigration of metal atoms and voltage drop. Electromigration places a limit on the useful lifetime of the circuit, and, if not properly accounted for, can present a serious reliability problem. As a phenomenon that happens over an extended pe.iod of time, elecffomigration depends on all possible cu...