نتایج جستجو برای: aluminum profile

تعداد نتایج: 271112  

Journal: :Molecules 2009
Fang Wang Juan Xu Heyi Luo Jinggang Wang Qian Wang

Practical adhesion of rubber to aluminum is measured for various aluminum silanization treatments. In this study, 6-(3-triethoxysilylpropylamino)-1,3,5-triazine-2,4-dithiol (TES) was used as the coupling agent for preparing self-assembly monolayers (SAMs) on an aluminum surface. The structure and chemical composition of the SAMs were analyzed using Fourier transform infra-red spectroscopy (FT-I...

2017
Tzu-Lin Wang Yu-Wei Fang Jyh-Gang Leu Ming-Hsien Tsai

The cardiothoracic ratio (CTR) and serum aluminum levels are both associated with mortality in hemodialysis patients. However, limited data regarding the association between serum aluminum levels and the CTR have been published to date. Therefore, we aimed to elucidate this association in patients on chronic hemodialysis (CHD). We investigated the association between the serum aluminum level an...

Journal: :CoRR 2009
S. Butdee Chaiwat Noomtong Serge Tichkiewitch

Aluminum extrusion die manufacturing is a critical task for productive improvement and increasing potential of competition in aluminum extrusion industry. It causes to meet the efficiency not only consistent quality but also time and production cost reduction. Die manufacturing consists first of die design and process planning in order to make a die for extruding the customer’s requirement prod...

2014
Li Jianhua Wei Xing

The problems of blending electrolyzer and multi-constraint optimization of electrolytic aluminum scheduling in the electrolytic aluminum production process were addressed. Based on a mathematical model analysis, a novel hybrid optimization algorithm is proposed for optimization of blending together the molten aluminum in different electrolytic cells. An affinity degree function was designed to ...

2011
Muhammad Khan Min Sung Kim

The constant demand to scale down transistors and improve device performance has led to material as well as process changes in the formation of IC interconnect. Traditionally, aluminum has been used to form the IC interconnects. The process involved subtractive etching of blanket aluminum as defined by the patterned photo resist. However, the scaling and performance demands have led to transiti...

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