The possibilities for inclusive diffraction in the Electron Ion Collider, EIC, US, are analyzed. We find that thanks to excellent forward proton tagging, EIC will be able access a wider kinematical range of longitudinal momentum fraction and transfer leading than at HERA. This opens up possibility measure subleading diffractive exchanges. extended t-range would allow precise extraction 4-dimens...

The italian Electronic Identity Card (EIC, for short) is a polycarbonate smart card equipped with a microchip (supporting cryptographic functions) and a laser band (featuring an embedded hologram). It contains personal (e.g. name, surname, date of birth, . . . ) and biometric data (photo and fingerprint) of a citizen. The EIC is an identity document which, according to Italian Laws, is fully eq...

Energy-harvesting-powered computing offers intriguing and vast opportunities to dramatically transform the landscape of Internet of Things (IoT) devices and wireless sensor networks by utilizing ambient sources of light, thermal, kinetic, and electromagnetic energy to achieve battery-free computing. In order to operate within the restricted energy capacity and intermittency profile of battery-f...

Abstract Understanding energetic particle transport due to magnetohydrodynamic instabilities excited by particles is essential apprehend alpha confinement in a fusion burning plasma. In the large helical device (LHD), beam ion and deuterium–deuterium fusion-born triton resistive interchange mode destabilized helically-trapped ions (EIC) are studied employing comprehensive neutron diagnostics, s...

On behalf of everyone at PR&P, I convey the passing of our Editorin-Chief, Dr Darrell Abernethy. Darrell has been part of PR&P since its inception, initially as Deputy EiC and since 2016 as EiC. He was a stalwart of the journal and assisted in the recruitment of a strong editorial board and the communication with editors of its supporter journals. From a professional perspective, Darrell had a ...

WITH THE MANUFACTURING CAPACITY of thousands of wafers per week, and thousands of dies per wafer, today's silicon comes out of fab really fast—and furious—sporting device I/Os in the gigabit-per-second range. But it is increasingly going into high-volume and low-cost consumer electronic parts, exhausting the available time and money to test these parts. Little wonder that the 2003 International...