نتایج جستجو برای: unbonded post

تعداد نتایج: 404685  

2008
Bradley F. Dutton Lee W. Lerner Charles E. Stroud

A Built-in Self-test (BIST) approach is presented for testing the programmable I/O cells in Field Programmable Gate Arrays (FPGAs). Using this approach, three BIST architectures and a total of 78 BIST configurations were developed to test the I/O cell logic resources and I/O buffers in all modes of operation in Xilinx Virtex-4 FPGAs. Each BIST configuration is valid for both bonded and unbonded...

Journal: :Clinical chemistry 1984
K Kushida K Oka T Suganuma T Ishizaki

We describe the simultaneous determination of lidocaine and its pharmacologically active metabolites, monoethylglycinexylidide and glycinexylidide, in plasma by "high-performance" liquid-chromatography. By use of a bare ( unbonded ) silica gel with aqueous eluents, separations of organic amines such as lidocaine and its metabolites, which are very difficult and have a poor peak symmetry on bond...

2004
Michael Pollino

In assessments of the seismic adequacy of existing steel bridges, the anchorage of steel truss piers to their foundations often has insufficient strength to resist seismic demands. Many other non-ductile failure locations may also exist along the seismic load path that cannot provide adequate seismic performance. Although strengthening is an option, this approach may only transfer damage to ano...

Journal: :Personality & social psychology bulletin 2012
Paul W Eastwick Eli J Finkel

Natural selection modified the attachment-behavioral system to bond adult mating partners in early members of the genus Homo, thus facilitating increased investment, especially paternal investment, in offspring. Previously existing adaptations that fostered intersexual conflict (e.g., ovulatory adaptations) could have threatened attachment bonds; therefore, the attachment-behavioral system migh...

2017
C M. Hu W H. Li M Chen M. Chen

Ultrasonic wire bonders with precision capillary tips are widely used for bonding electrical wires to IC chips and circuits. The industry is driving wire-bonding technology towards increased yields, decreased pitch, and ever decreasing cost. However, many technical and material issues will be involved in achieving these goals, such as bond quality monitoring, new failure modes, reliability prob...

Journal: :Physical chemistry chemical physics : PCCP 2017
Xinquan Wang Zhigang Wu

It has been long sought to create magnetism out of simple non-magnetic materials, such as silicon and germanium. Here we show that intrinsic magnetism exists in bilayer silicene and germanene with no need to cut, etch, or dope. Unlike bilayer graphene, strong covalent interlayer bonding formed in bilayer silicene and germanene breaks the original π-bonding network of each layer, leaving the unb...

2006
SF Yoon CY Liu ZZ Sun KC Yew

Self-assembled GaInNAs quantum dots (QDs) were grown on GaAs (001) substrate using solidsource molecular-beam epitaxy (SSMBE) equipped with a radio-frequency nitrogen plasma source. The GaInNAs QD growth characteristics were extensively investigated using atomic-force microscopy (AFM), photoluminescence (PL), and transmission electron microscopy (TEM) measurements. Self-assembled GaInNAs/GaAsN ...

Journal: :The Journal of chemical physics 2013
Panagiotis E Theodorakis Christoph Dellago Gerhard Kahl

We discuss a coarse-grained model recently proposed by Starr and Sciortino [J. Phys.: Condens. Matter 18, L347 (2006)] for spherical particles functionalized with short single DNA strands. The model incorporates two key aspects of DNA hybridization, i.e., the specificity of binding between DNA bases and the strong directionality of hydrogen bonds. Here, we calculate the effective potential betw...

2001
Yu-Ting Cheng Liwei Lin Khalil Najafi

A hermetic package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. Less than 0.2 MPa contact pressure with 46 mA current input for two parallel 3.5m-wide polysilicon on-chip microheaters can raise the temperature of the bonding region to 700 C bonding temperature and achieve a strong and reliable bond in 7.5 min. The formation of aluminum oxide with sili...

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