An investigation has been made of the potential of pulsed transient thermography for identifying the location of fixtures beneath aircraft skins to facilitate accurate automated assembly operations. Experimental studies have been made of 1.6mm thick aluminium skins and both 2mm and 4mm thick carbon fibre reinforced plastic (CFRP) composite skins over both aluminium and composite struts, represe...

A region of resistive domains is found in composite superconductors with thermal and electrical contact resistance between the normal metal matrix and the superconductor. The V-I characteristic of 3 sample with resistive domains is found. It is shown that the existence of resistive domains leads to the emergence of hysteresis upon decay and recovery of superconductivity in the presence of trans...

The monitoring of heat flux is becoming more and more critical for many technologies approaching nanometric dimensions. Scanning Thermal Microscopy (SThM) is one of the tools available for thermal measurement at the nanoscale. This measurement technics needs calibration samples. Therefore, micro-hotplates made of platinum heater suspended on thin silicon nitride (SiN) membranes were fabricated ...

A computational model was developed to study the thermal conductivity of single-walled carbon nanotube (SWNT)-polymer composites. A random walk simulation was used to model the effect of interfacial resistance on the heat flow in different orientations of SWNTs dispersed in the polymers. The simulation is a modification of a previous model taking into account the numerically determined thermal ...

the objective of this research is characterizing the effect of nano-zinc oxide (nano-zno) dispersions on leach resistance and contact angle of beech wood (fagus orientalis lipsky). the beech wood was cut into standard dimension, and oven dried after treating with nano-zno solution, based on immersion method. three treating nano-zno solution levels: (o, 20000 and 40000 ppm), and two thermal trea...

The thermal resistance of the attachment between a die and its carrier contributes strongly to the total temperature rise in an electronic system. The die attach resistance often differs substantially from the value predicted using the bulk thermal conductivity of the attachment material because of partial voiding and delamination. These defects can be introduced during the attachment process o...

This work discusses measurement of thermal conductivity (k) of films using a scanning hot probe method in the 3ω mode and investigates the calibration of thermal contact parameters, specifically the thermal contact resistance (R(th)C) and thermal exchange radius (b) using reference samples with different thermal conductivities. R(th)C and b were found to have constant values (with b = 2.8 ± 0.3...

This paper proposed a half-experimental model to reconstruct the die-bonding thermal path of highpower light-emitting diodes (HP-LEDs). In this model, the partially insufficient filling of bonding materials and their directional/random distributions (“filling state” for short) have been taken into consideration. Both the silver-paste structure and the Au/Sn-eutectic structure were analyzed and ...