Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile elect...

The increasing demand for feature content of portable electronic products drives requirements for smaller volume and lower cost device packaging. This has, in turn, led to the packaging industry’s interest in stacked chip technology, especially for memory applications. The growth of stacked chip package technology drove development of specific die adhesives that combine low cost with controlled...

It is well known that enhancing interfacial adhesion between inorganic filler and matrix resin in a composite lead to favorable properties such as excellent mechanical properties, high thermal resistance, prominent electric insulation, low expansion coefficient, and so on. But it should be avoided that much excess of coupling agent is reacted due to a negative impact of their final composite’s ...

A new generation of designer solvents, low transition temperature mixtures (LTTMs) could be the ideal solvent for the separation of the main biopolymers in lignocellulosic biomass such as lignin, cellulose and hemicellulose. The separated biopolymers have prospective to be converted into high valuable products. LTTMs can be synthesized from two natural high melting point materials through hydro...

In this article, a novel Pyrex reflow bonding technology is introduced which bonds two functional units made of silicon via a Pyrex reflow bonding process. The practical application demonstrated here is a precision dosing system that uses a mechanically actuated membrane micropump which includes passive membranes for fluid metering. To enable proper functioning after full integration, a techniq...

INTRODUCTION Common bonding techniques for lab-on-chip (LOC) microfluidic devices require surface bio-functionalization to be performed in-situ after the chip has been packaged due to the bio-incompatible features of the bonding technique, including high temperature requirements (e.g. thermal bonding of thermoplastics), use of organic solvents (e.g. PMMA bonding) or plasma activation (e.g. PDMS...

Fluorinated graphene, an up-rising member of the graphene family, combines a two-dimensional layer-structure, a wide bandgap, and high stability and attracts significant attention because of its unique nanostructure and carbon-fluorine bonds. Here, we give an extensive review of recent progress on synthetic methods and C-F bonding; additionally, we present the optical, electrical and electronic...

This article presents a literature review on the resin bond to zirconia ceramic. Modern esthetic dentistry has highly recognized zirconia, among other ceramic materials. Biocompatibility of zirconia, chemical and dimensional stability, excellent mechanical properties, all together could guarantee optimal therapeutical results in complex prosthodontic reconstruction. On the other hand, low therm...

A reliable Cu-Cu bonding joint was achieved by using the highly sinterable Cu nanoparticle paste. Pure copper nanoparticles used in the preparation of nanoparticle paste were synthesized through simple routes, with an average size of 60.5 nm. Under an Ar-H2 gas mixture atmosphere, the Cu nanoparticle paste exhibited large areas of fusion after sintering at 300 °C and reached a low electrical re...

The purpose of this study was to examine the effect of thermal cycling on microleakage of a fissure sealant after it was bonded with different bonding agents and polymerized with different light curing units. To this end, two bonding agents (Xeno III, iBond), three light curing units (Astralis 3, Elipar free-light, Elipar free-light 2), and a fissure sealant (Fissurit FX) were used. Microleakag...