This paper reports a new method for making high aspect ratio Single Crystalline Silicon (SCS) microstructures om multi layer substrates using Chemical Mechanical Polishing (CMP), Silicon Fusion Bonding (SFB) and Reactive Ion Etching (NE) techniques. First Si-Si02-PolySi-Si02-Si sandwich wafers were fabricated using CMP and SFB. Then microstructures were fabricated on these sandwich wafers using...

Micromachined thermal multimorph actuators for out-of-plane displacements have been designed and fabricated by Multi-Users MEMS Process (MUMPs) with a post-processing bulk etching step. Micromachined actuators have potential applications in micromanipulation and nanoposition such as manipulation of scanning tunneling microscope (STM) tips, nanopositioner for nano-assembly, micro/nanorobots and ...

Microsystems using electrothermal bent-beam microactuators have been demonstrated for a variety of applications including optical attenuators, RF switches, and micro positioners for scanning microscopy, creating an important need for information on the longevity of these devices. This paper reports on the lifetime pulse testing results of polysilicon actuators. Devices have been operated up to ...

A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.35 μm complementary metal oxide semiconductor (CMOS) process was investigated. The structure of the ammonia sensor is composed of a sensitive film and polysilicon electrodes. The ammonia sensor requires a post-process to etch the sacrificial layer, and to coat the sensitive fil...

This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology...

0167-9317/$ see front matter 2012 Elsevier B.V. A http://dx.doi.org/10.1016/j.mee.2012.07.048 ⇑ Corresponding author. E-mail address: [email protected] (D. Sacch We report on the top-down fabrication of vertically-stacked polysilicon nanowire (NW) gate-all-around (GAA) field-effect-transistors (FET) by means of Inductively Coupled Plasma (ICP) etching and nanostencil lithography. The nan...

MUMPs (Multi-User MEMS Process) based microchannels made of either glass or polysilicon have been successfully designed, fabricated and tested. The fabrication process used timed wet-chemical etching to selectively etch sacrificial materials with the assistance of etch holes. The prototype glass and polysilicon microchannels have cross-section areas of 70 m×4 m and 70 m×2 m, respectively, and b...

This paper presents a preliminary study concerning the use of Front-Side Bulk Micromachining (FSBM) for inertial sensing. When using such a low-cost fabrication approach, the obtained suspended structure do not feature important seismic mass while both CMOS design rules and wet etching do not allow for capacitive detection. Using the standard CMOS polysilicon for piezoresistive detection, obtai...

In the last decade, examples of devices manufactured with SUMMiT technology have demonstrated the capabilities of polysilicon surface micromachining [1]. Currently we are working on enhancements to this technology that utilize additional structural layers of silicon nitride to enable Microfluidics and BioMEMS applications. The addition of the silicon nitride layers allows the fabrication of mic...

The suitability of polysilicon as a material for the fabrication of interdigitated electrodes and their application to the development of sensors is studied in this work. The main interest in using this material lies in the possibility of obtaining integrated sensors with commercial CMOS technologies and simple post-processing steps. Electrodes with 3μm finger width and 3, 10, and 20μm spacing ...