ARTICLE INFO Cooling of electronics component is one of the major challenges faced by thermal engineers. In recent years, a significant increase in microprocessor power dissipation coupled with CPU size has resulted in an increase in heat fluxes. Microprocessor heat fluxes have also increased for many commercial applications. Therefore, thermal management is becoming one of most challenging iss...

Molecular dynamics simulations are performed to study the cooling process of quasi-2D liquid carbon. Our results show an obvious liquid-liquid phase transition (LLPT) from the twofold coordinated liquid to the threefold coordinated liquid with the decrease of temperature, followed by a liquid-solid phase transition (LSPT). The LLPT can be regarded as the preparation stage of LSPT. During the co...

This article presents a transient model of a solar adsorption cooling system. A computer program has been developed to simulate the operation of a two bed silica gel- water adsorption cooling system as well as flat plate collectors and the hot water storage tank. This program is then utilized to simulate the performance of a sample solar adsorption cooling system used for cooling a set of r...