Improving the excitation conditions in two-photon fluorescent lithography reduces the size of the fabricated structures to nanometre scales. We demonstrate that a precise control of the illumination profile and the scanning speed of the laser beam is enough to decrease the photo-polymerization volume of resins by orders of magnitude. This work also shows experimental evidence of surface effects...

Two types of lithographic methods were used to modify GaP(100) surfaces with commercially available alkanethiol molecules: microcontact printing (lCP) and ‘‘dip-pen” nanolithography (DPN). The patterned surfaces were characterized by atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared reflection absorption spectroscopy (FT-IRRAS). The characteriz...

This paper presents a design approach for fabricating an array of MEMS mirrors suitable for maskless lithography applications in a commercial CMOS process. A small footprint mirror design is presented which uses a pair of support beams for signal routing and diagonal gap-closing actuators for mirror deflection. The actuators are shown to be capable of delivering up to 10nN of force per micron o...

The technologies for future lithography have been proposed, such as i-line phase-shifting lithography, deep-UV lithography and electron beam lithography. We have proposed several types of chemical amplification resist systems for future lithography. These are based on the change in dissolution rate by acid catalyzed reaction for aqueous development: dissolution inhibitor to dissolution promoter...

In the 30 years since lithography modeling was first introduced, optical lithography simulation has progressed from a curiosity, to a research and development tool, and finally to a manufacturing tool. While much has been published on new developments in lithography simulators and their use in advanced lithography development, less is published on how simulators have been used and are soon to b...

The end of optical lithography has been so often predicted (incorrectly) that such predictions are now a running joke among lithographers. Yet optical lithography does have real, physical limitations and even more real economic limits, and an accurate estimation of these limits is essential for planning potential next generation lithography (NGL) efforts. This paper will review the two types of...

We have investigated two process techniques: resist ashing and oxide hard mask trimming. A combination of ashing and trimming produces sub-30-nm MOSFET gate. These techniques require neither specific equipment nor materials. These can be used to fabricate experimental devices with line width beyond the limit of optical lithography or high-throughput -beam lithography. They provide 25-nm gate pa...

We discuss the notion of a ‘shared technology roadmap’ between lithography and design from several perspectives. First, we examine cultural gaps and other intrinsic barriers to a shared roadmap. Second, we discuss how lithography technology can change the design technology roadmap. Third, we discuss how design technology can change the lithography technology roadmap. We conclude with an example...