The thermal management of high heat fluxes is a critical roadblock in the way of higher-performance microelectronics. The ongoing reduction in microtransistor size translates into heat fluxes comparable to those encountered in nuclear reactions and rocket nozzles, but under much severer temperature constraints. Although the average heat flux may remain in the vicinity of 100 to 300 W/cm, the pe...

The flow in the turbine endwall region consists of complicated secondary structures driven by lateral pressure gradient, which heavily affects performance film cooling. In this work, film-cooling hole design optimization is performed considering existence gradient real environment. Results have shown that optimal influenced region, especially compound angle clearly different from flat plate res...