نتایج جستجو برای: chemical vapor deposition

تعداد نتایج: 477188  

2007
H. Xia L. Lu Y. S. Meng G. Ceder

Phase Transitions and High-Voltage Electrochemical Behavior of LiCoO2 Thin Films Grown by Pulsed Laser Deposition H. Xia, L. Lu, Y. S. Meng, and G. Ceder* Advanced Materials for Microand Nano-System, Singapore-MIT Alliance, Singapore 117576 Department of Mechanical Engineering, National University of Singapore, Singapore 117576 Department of Materials Science and Engineering, Massachusetts Inst...

Journal: :Microelectronics Reliability 2007
Stefan Holzer Alireza Sheikholeslami Markus Karner Tibor Grasser Siegfried Selberherr

We present a comparison of models describing the pyrolytic deposition of SiO2 with a low pressure chemical vapor deposition process. In order to meet industrial simulation requirements, e.g. accuracy and fast delivery of results, we present an overview of established and new models, their use within TCAD applications, and their best results which have been obtained by calibrations according to ...

2005
Titta Aaltonen Markku Leskelä Mikko Ritala

3 Preface 4 List of publications 5 List of symbols and abbreviations 6

2016
Subrina Rafique Lu Han Adam T. Neal Shin Mou Marko J. Tadjer Roger H. French Hongping Zhao

2016
Nicholas R. Glavin Christopher Muratore Michael L. Jespersen Jianjun Hu Timothy S. Fisher Andrey A. Voevodin

2017
J. Shi Yongfeng Lu X. Y. Chen R. S. Cherukuri K. K. Mendu H. Wang N. Batta Y. F. Lu

2015
Xiuju Song Junfeng Gao Yufeng Nie Teng Gao Jingyu Sun Donglin Ma Qiucheng Li Yubin Chen Chuanhong Jin Alicja Bachmatiuk Mark H. Rümmeli Feng Ding Yanfeng Zhang Zhongfan Liu

2012
Raffaella Calarco

An overview on InN nanowires, fabricated using either a catalyst-free molecular beam epitaxy method or a catalyst assisted chemical vapor deposition process, is provided. Differences and similarities of the nanowires prepared using the two techniques are presented. The present understanding of the growth and of the basic optical and transport properties is discussed.

Journal: :Micromachines 2016
Takafumi Fukushima Hideto Hashiguchi Hiroshi Yonekura Hisashi Kino Mariappan Murugesan Ji Chel Bea Kang Wook Lee Tetsu Tanaka Mitsumasa Koyanagi

Plasmaand water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In this study, chemical mechanical polish (CMP)-treated oxide formed by plasma-enhanced chemical vapo...

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