MCM-D has been the solution for integrated high density packaging due to its superior line resolution and higher I/O density compared to MCM-C and MCM-L technologies. However, the consumer demand for high performance products at reduced costs is ever increasing, and this trend is expected to continue in the 21st Century. In order to find a low-cost solution for future MCM-D packaging, a novel p...

Title of Thesis: Effect of Initial Curvature of Printed Wiring Board on Vertical Stresses in Interconnects Mark Mifsud, Master of Science, 2015 Thesis directed by: Professor Abhijit Dasgupta Department of Mechanical Engineering During the solder reflow process used for attaching surface mount packages to printed wiring boards (PWBs), the possibility exists for the PWB and component to warp and ...

Front Cover: When using material extrusion (MEX) method to print parts made of Polyether-ether-ketone (PEEK), due the uneven distribution temperature field and stress field, prone warping deformation. Reveals influence rules each printing parameter coupling effect between them on warpage This lays a foundation for realization PEEK denture forming by MEX. is reported Jiang Han, Ju Tong, Xiaoqing...