In order to successfully implement reliable Flip Chip packaging technology, it is desirable to ensure solder fatigue as the limiting mechanical failure mechanism. Doing so enables the packaging engineer to design to specific reliability standards, as solder fatigue is a known and predictable failure mechanism. Indeed, other Flip Chip failure modes such as silicon fracture and underfill delamina...

Service conditions of turbine blades involve fatigue, creep, and environmental corrosion. Themanner in which these mechanisms interact to initiate cracks is complex. These physicalmechanisms have been observed through observation and measurement of damage in adirectionally-solidified (DS) GTD-111 Ni-base superalloy. Experiments include high temperaturelow cycle fatigue with and ...

As a new treatment process after welding, the process parameters of laser shock peening (LSP) in dynamic strain aging (DSA) temperature regimes can be precisely controlled, and the process is a non-contact one. The effects of LSP at elevated temperatures on the distribution of the surface residual stress of AA6061-T6 welded joints were investigated by using X-ray diffraction technology with the...

Accurate testing history data is necessary for all fatigue life prediction approaches, but such data is always deficient especially for the microelectronic devices. Additionally, the sequence of the individual load cycle plays an important role in physical fatigue damage. However, most of the existing models based on the linear damage accumulation rule ignore the sequence effects. This paper pr...

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without...

Thermal stress, wear and material damage produce effects of high-cycle fatigue failures in aircraft engines. The loading configuration on turbine blades of aircraft engines consists of an axial load. The axial load is the centrifugal force combined with the tensile and compressive loads, caused by the natural vibrations of the blades themselves. Low-cycle fatigue and high-cycle fatigue loading ...

The Low Temperature Transient Liquid Phase Diffusion Bonding (L TTLP) process has been used to reduce the residual stresses and hence, improve the thermal fatigue performance of bonds between dissimilar electronic packaging materials. Aluminum oxide plated with either gold or copper has been bonded to copper heatsinks at temperatures less than 160°C using In-Sn eutectic solders. After two hour...

This paper presents finite element analysis (FEA) of a coated and uncoated cylinder heads of a diesel engine to examine the distribution of temperature and stress. A thermal barrier coating system was applied on the combustion chamber of the cylinder heads, consists of two-layer systems: a ceramic top coat (TC), made of yttria stabilized zirconia (YSZ), ZrO2-8%Y2O3 and also a metallic bond coat...