We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obtained using TB. Parameters such as metal thickness of electrodes, depth of electrode embedding, d...

Supramolecular organic frameworks (SOFs) based on pyrogallol[4]arene and 4,4'-bipyridine-type spacer molecules have been investigated. The hydrogen bonding pattern and molecular arrangement in the crystal structures are engineered through the cocrystallization approach. The length of the spacer molecules and the C-alkyl tail length of the PgC macrocycle are tuned to influence the hydrogen bondi...

In this paper a functional graded material (FGM) thermal barrier coating (TBC) is prepared using Atmospheric Plasma Spraying (APS) method. The FGM layers were deposited by varying the feeding ratio of CYSZ/NiCrAlY and conventional CYSZ on a NiCrALY-coated Inconel 738 substrates. Hot corrosion behavior, bonding strength and the related failure mechanisms of a conventional TBC and a FGM TBC are i...

Several heat transfer problems related to singlewalled carbon nanotubes (SWNTs) are considered through molecular dynamics (MD) simulations. MD simulations of thermal conductivity along a nanotube, isotope effect in longitudinal thermal conductivity, and thermal boundary resistance in a junction of nanotubes are reviewed. Then, the heat transfer from an SWNT to various surrounding materials is s...

Understanding the underlying mechanisms that suppress thermal conduction in solids is of paramount importance for the targeted design of materials for thermal management and thermoelectric energy conversion applications. Bismuth copper oxychalcogenides, BiOCuQ (Q = Se, Te), are highly crystalline thermoelectric materials with an unusually low lattice thermal conductivity of ∼0.5 Wm(-1) K(-1), a...

Lithium ion battery electrodes were manufactured using a new, completely dry powder painting process. The solvents used for conventional slurry-cast electrodes have been completely removed. Thermal activation time has been greatly reduced due to the time and resource demanding solvent evaporation process needed with slurry-cast electrode manufacturing being replaced by a hot rolling process. It...

The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermocompression bonded dice at 10μm and 15μm pitch in large area arrays are shown. The interconnect bonding process pressure and temperature required for the formation of low resistance (<100 mΩ), high yielding (99.99% individual bond yield), and reliable interconnects is described. In the case of Cu/Sn-Cu, use of a m...

Five carbons with different graphitization degrees, which were heat-treated at temperatures of 1273 to 3273K, were prepared. These carbons were bonded to nickel in a vacuum, using an RF-induction furnace, with joining temperatures of 1073 to 1273K. On the basis of the results of these experiments, the effects of the graphitization degree on the solid-state bonding of carbon to nickel were exami...

New interconnection materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. In particular, anisotropic conductive adhesives (ACAs) have gained popularity as a potential replacement for solder interconnects. Despite numerous benefits, ACA-type packages pose several reliability problems. During the l...