Leaded solder ball was replaced by leadfree solder ball which is now widely used in semiconductor industries, due to the hazardous effects of lead to human’s health and toxicity for environment. Due to this, poor solder joint strength for Ball Grid Array (BGA) packages on leadfree devices is a reliability concern when subjected to reliability stress test. With a polymer core in the solder ball ...

A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package size, 15 to 25 mm in die size, and 672 to 1020 in ball count. With dies and packages so large, solder joint fatigue failure and underfill delamination, induced by thermal expansion mismatch, are a major concern. Finite element analysis was set up for efficient reliability analysis....

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.08.017 ⇑ Corresponding author at: STMicroelectronics, 16 7155, 37071 Tours Cedex 2, France. Tel.: +33 (0)2 47 01 34. E-mail address: [email protected] (S. Jacqu In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the fo...

In the past few years, many studies have reported on the formula of solder metal alloy materials. This paper discusses the influence of organic materials characters, the decomposing rate of flux in lead-free solder paste and coefficients of thermal expansion (CTE) of halogen-free mold compounds during the on-board reliability test, and the failure mechanism in both 63Sn/37Pb and Sn–3.5Ag–0.5Cu ...

The 6063 Aluminum alloy brazing joint was prepared with the Al-Si12 solder. effect of welding time on structure and shear properties weld is studied interface analyzed. study shows that spreading performance brder gradually increases time, strength aluminum increase first then decreases time. When optimal process 605°C 15min, between solder good, 122.4MPa. To ensure bonding alloy, insulation 15...

The Printed Circuit Board (PCB) assembly domain has almost completed its transition to a lead-free environment. This shift has resulted in the obsolescence of tin-lead components. However, occasionally, on-going production or repair processes require SnPb components which are no longer available. Using a lead-free device in such cases could result in reliability concerns (due to the use of lead...

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The effect of Al on the corrosion resistance behaviour of Pb-free Sn–1.0Ag–0.5Cu–xAl solder (x 1⁄4 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive ...