The main joining process of the electronic industry is still soldering with different alloys Sn. This work studied relationship between Sn whisker growth and corrosion resistance 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder in a corrosive environment via scanning electron microscopy focused ion beam techniques. test showed that application TiO2 ZnO nano-particles almost totally suppressed...

Reliability in flip chip and Ball Grid Array is a major concern. Solder joint geometry is extremely important from a reliability point of view. Commonly, the flip chip solder bump takes on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that the hourglass-shaped solder bumps experience the lowest plastic strain and have the longest lifetime. In...

This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact ...

Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...

Finite element modelling (FEM) has been widely used for the estimation of the lifetime of solder joints subjected to temperature cycling. Thanks to the expertise of decades, a significant number of companies, universities and research institutes were able to have a relatively accurate estimation of life time for SnPb solder. For the leadfree solder materials, first attempts for correlation mode...

Abstract This paper presents the results of Ni substrate wetted with liquid Sn-Zn eutectic alloy addition Ag, Al, and Li (84.3 at.% Sn, 13.7 Zn, 1 0.5 Li-SZAAL). The wetting tests were performed using two methods: balance (WBT) sessile drop (SD) method at 250 °C, in presence an ALU33® flux. times 5, 20, 60, 180, 1800 s. Next, microstructure selected solidified solder joints was investigated sca...