نتایج جستجو برای: solder

تعداد نتایج: 2669  

2005
Toni Mattila

The reliability of portable electronic devices was studied by applying standardized test procedures for test vehicles that represent the technologies and lead-free materials typically used in novel portable products. Thermal cycling and drop testing are commonly used because they reveal the failure modes and mechanisms that portable devices experience in operational environments. A large number...

Ebrahimzadeh, Saeed, Ghanbarzadeh, Jalil, Moady Rodsari, Ali, Sabooni, Mohammad reza,

Comparison of flexure resistance between two rod and paste solders in base metal alloy Dr. MR. Sabooni* - Dr. J. Ghanbarzadeh*- S. Ebrahimzadeh** - Dr. A. Moady Rodsari *** * Assistant Professor of Dental Prostheses Dept., Faculty of Dentistry, Mashhad University of Medical Sciences. ** Member of Faculty of Nursing, Mashhad University of Medical Sciences. *** Member of Communicative Medicine an...

2009
M. O'Keefe Michael O’Keefe

This paper presents three power module cooling topologies that are being considered for use in electric traction drive vehicles such as a hybrid electric, plug-in hybrid electric, or electric vehicle. The impact on the fatigue life of solder joints for each cooling option is investigated along with the thermal performance. Considering solder joint reliability and thermal performance, topologies...

2005
Bill Long Mike Prevallet John Prymak

Ceramic capacitors have proven themselves very reliable with extremely low failure rates. As processes continue to improve, reliability of the dielectric also continues to increase. This increase in the reliability of the dielectric has caused other categories to emerge as the main contributors to the overall failure rate. A recent review of field failure analysis of surface mount MLCCs, has sh...

Journal: :journal of dental research, dental clinics, dental prospects 0
milad motamedi farnaz fattahi

background and aims. in order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. however, these prostheses always fail at their solder joints. the purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. materials and methods. based on ada/iso 9693 specifications...

2010
Xiaofei He Michael H. Azarian Michael G. Pecht

Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction in surface insulation resistance (SIR) between adjacent conductors, generate a path of leakage current, and lead to intermittent or catastrophic circuit failures. Solder mask has been widely used on printe...

Journal: :Investigative ophthalmology & visual science 2007
Guillermo Noguera Woo-Seok Lee Juan Castro-Combs Roy S Chuck Barbara Soltz Robert Soltz Ashley Behrens

PURPOSE To compare the effectiveness of a laser-activated biological tissue solder with that of standard sutures for sealing corneal incisions. METHODS Two keratome knives measuring either 3.0 mm or 2.85 mm were used to create a non-self-sealing peripheral oblique corneal wound (POCW) or a central perpendicular corneal wound (CPCW) in fresh rabbit cadaver eyes. Wounds were sealed with a solde...

2005
Masayuki Kitajima Tadaaki Shono

Fujitsu has implemented a company-wide effort to progressively reduce the use of lead (Pb) and eventually eliminate this environmental pollutant from its products. As part of this effort, we have developed a new lead-free solder that consists of tin (Sn), zinc (Zn), and aluminum (Al) and yet offers superior productivity and joint reliability. The new lead-free solder has a melting point equival...

2013
Elviz George Michael Osterman Michael Pecht Richard Coyle Richard Parker Elizabeth Benedetto

Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a continued search for alternative solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-AgCu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. Mor...

1998
N. D. Morozova W. Zhang R. Irwin Bingzhi Su Y. C. Lee

A new flip-chip solder technology has been developed for the precision self-alignment of an optoelectronic module without using mechanical stops. A main feature of the technology is the controlled self-alignment sequence: laser is aligned to a polymer waveguide in the lateral and vertical directions, then it slowly makes a contact with the waveguide in the axial direction. The elimination of th...

نمودار تعداد نتایج جستجو در هر سال

با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید