Thermal contact constriction between a chip and a heat sink assembly of a microelectronic application is investigated in order to access the thermal performance. The finite element model (FEM) of the electronic device developed using ANSYS software was analysed while the micro-contact and micro-gap thermal resistances were numerically analysed by the use of MATLAB. In addition, the effects of f...

The fabrication process of modern microelectronic devices faces a significant challenge regarding the uniformity wafer processing during plasma etching. Particularly, nonuniformity is prominent at edge due to varying electrical properties, leading sheath bending and distorted ion trajectories. To address this issue, terminating structure known as focus ring employed modify near ensure uniform f...

Pedagogy This paper presents some of the techniques used at the University of Massachusetts Dartmouth to introduce analog microelectronic system design to undergraduate electrical engineering students. The following paper discusses a wide range of assignments that attempt to address student’s varied learning styles. These assignments not only take the form of traditional homework, but also incl...

This work presents collaboration between electronics industry and University aimed to develop novel power cycling methodology combined with IR thermography for quality and reliability studies of microelectronic assemblies. For this purpose an array of programmable Thermo Electric Converters (TEC) was designed and constructed [1]. The array provides possibility of introduction of controlled anis...

The purpose of this part of the notes is to briefly review some of the prerequisite course materials related to characteristics of active device in microelectronic circuits. We summarize dc, large-signal and small-signal (incremental) models of two major types of active devices used in analog, digital and mixed-mode integrated circuits: metal-oxide-semiconductor field-effect transistors (MOSFET...

Versatile, highly selective, and inexpensive metal patterning techniques on various substrates are demanded for current research in microelectronic device fabrications. We present a new process for creating highly selective and cost-effective copper patterns that can be plated on virtually any substrate including plastics by combining polyelectrolyte multilayer (PEM) coatings, microcontact prin...

Introduced as a tool for electrophysiology three and a half decades ago, the ion-sensitive field-effect transistor (ISFET) is a generic electrochemical structure offering a family of analytical devices for applications in agriculture, food processing, medical diagnostics, pharmaceuticals, paper, pulp and chemical industries, and environmental control. Besides its use as a chemical sensor, this ...

Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include...

The evolving of current and future broadband access techniques into the wireless domain introduces new and flexible network architectures with difficult and interesting challenges. The system designers are faced with a challenging set of problems that stem from access mechanisms, energy conservation, error rate, transmission speed characteristics of the wireless links and mobility aspects. This...