نتایج جستجو برای: kirschners wire

تعداد نتایج: 29977  

2006
Takehiro WATANABE Souta MATSUSAKA Tsutomu WADA

Direct microjoining using Yttrium-Aluminium-Garnet (YAG) laser beams of copper wire and a plate or substrate board was carried out. The control of the behavior of the molten wire was extremely important to prevent joining defects such as evaporation or constriction of the wire. Both the contact angle between the wire and the plate and the distance from the tip of the wire to the laser irradiati...

Journal: :AJNR. American journal of neuroradiology 1982
T M Chakera D E Hartley

Not uncommonly, when cerebral angiography is performed via the femoral route , a long flexible-tip guide wire may be introduced into the appropriate vessel , but because of tortuosity of the carotid artery the catheter does not follow the guide wire. During attempts to maneuver the catheter into the carotid artery, the catheter and guide wire are displaced into the aortic arch . To overcome thi...

2011
Kirk T. McDonald Joseph Henry

In 1861 Fizeau studied transmission of polarized light through a screen with subwavelength scratches [1], and in 1888 Hertz performed similar experiments with radio waves and a grid of wires, which transmited polarized electromagnetic waves, of wavelength λ large compared to the wire spacing d, only if the electric field of the wave was perpendicular to the direction of the wires. Explain these...

2017
Mark Gerber

You can configure the die stack for S-CSPs (stacked-die chip-scale packages) in multiple ways. However, using design guidelines can help you use die stacking for laminate-based and wire-bonded S-CSPs with more than 200 I/O pins. These packages typically find use in handheld products. When stacking mixed-technology dice, such as ASICs and memory, the challenge is often how to deal with wire-bond...

Journal: :Microelectronics Journal 2003
Delphine Meunier Sedat Tardu Dimitrios Tsamados Jumana Boussey

In this paper we present the impact of hot wire geometry and fluid characteristics on the efficiency of a hot wire to be used as a wall shear stress sensor. Finite differences and finite elements modelling based simulators were used in order to evaluate the thermal performances of hot wire wall shear stress sensor. Several structures were explored including simple conductor or suspended above a...

2013
Feng Tian Tengfei Fu Jing Fu

The paper introduces a new electronic tag device and describes system structure, design of software and hardware, critical circuit and communication protocols in details .Two-wire bus transmission is designed to replace the conventional RS485 four-wire transmission, which saves 50% of the conductive wire material. The experiment proves the feasibility of the system and the load capacity of the ...

This paper presents the designing, simulation, fabrication and control of a gripper actuated by Shape Memory Alloy (SMA) wire. The presented gripper has the advantage of the small linear displacement of the slider connected to the SMA wire, and can convert the linear displacement into angular movement of the gripper fingers. In this study, design and simulation processes have been done by two p...

V. Ahmadi

Field Ion Microscopy (FIM) and Scanning Tunneling Microscopy (STM) have found a wide application in nanotechnology. These microscopes use a metallic nanotip for image acquisition. Resolution of FIM and STM images depends largely on the radius of nanotip apex; the smaller the radius the higher the resolution. In this research, for tungsten nanotip fabrication, electrochemical etching of tungsten...

1994
Prasad R. Chalasani Krishnaiyan Thulasiraman M. A. Corneau

We first present a unged formulation to three problems in VLSI physical design: Layout compaction, Wire balancing and Integrated layout compaction and wire balancing problems. The aim of layout compaction is to achieve minimum chip width. Whereas wire balancing seeks to achieve minimum total wire length, integrated layout compaction and wire balancing seeks to minimize wire length maintaining t...

2015
Piyas Palit Souvik Das Jitendra Mathur

Tyre bead grade wire is used for tyre making application. The wire is used as reinforcement inside the polymer of tyre. The wire is available in different size/section such as 1.6-0.80 mm thin Cu coated wire. During tyre making operation at tyre manufacturer company, wire failed frequently. In this present study, different broken/defective wire samples were collected from wire mill for detailed...

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