نتایج جستجو برای: interconnect

تعداد نتایج: 11766  

2004
Lei He Andrew B. Kahng King Ho Tam Jinjun Xiong

Chemical-mechanical planarization (CMP) is an enabling technique to achieve uniformity of dielectric and conductor height in BEOL manufacturing processes. Dummy fill insertion improves the uniformity of metal feature density and enhances the planarization that can be obtained by CMP, but can also change the coupling and total capacitance of interconnects [1], [2]. Additionally, dishing and eros...

Journal: :IEEE Design & Test of Computers 2010
Partha Pratim Pande Sriram R. Vangal

COMMERCIAL DESIGNS currently integrate tens to hundreds of embedded functional and storage blocks in a monolithic SoC, and the number is expected to increase significantly in the near future. Specifically, molecular-scale computing will allow additional orders-of-magnitude improvements in device density. The possibility of such high levels of integration in a single chip necessitates the design...

2008
Katalin Popovici Ahmed Jerraya

Interconnect Component MEM T2 HDS API Transaction Accurate Architecture T2 T3 Comm OS HAL API HDS API SystemC TLM Interconnect Component (Bus/NoC) CPU-SS1 Abstract CPU1 Periph Interface Memory Abstract CPU2 Periph Interface Memory CPU-SS2 MEM-SS T2 HDS API Comm OS HAL API T3 HAL Virtual Prototype SystemC TLM CPU-SS1 CPU1 ISS Periph Interface Memory CPU2 ISS Periph Interface Memory CPU-SS2 Inter...

Journal: :CoRR 2012
Sumita Mishra Naresh K. Chaudhary Kalyan Singh

Optical interconnect is seen as a potential solution to meet the performance requirements of current and future generation of data processors. Optical interconnects have negligible frequency dependent loss, low cross talk and high band width. Optical interconnects are not much used commercially since optical interconnects technology is incompatible with manufacturing processes and assembly meth...

Journal: :Microelectronics Journal 2010
Tian Xia Di Mu

This paper focuses on modeling and characterizing the data dependent jitter (DDJ) in high-speed interconnect. The analysis process is performed based on the Fourier series using the interconnect RLC model. By calculating the pattern dependent delay deviations, the DDJ is characterized. To validate the model accuracy, the analysis results have been compared against Cadence simulations. The inter...

Journal: :Journal of Engineering Research and Reports 2020

Journal: :IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 1998

Journal: :Physical review research 2022

Connecting superconducting qubits to optical fiber necessitates the conversion of microwave photons photons. Modern experimental demonstrations exhibit strong coupling between a resonator and an cavity mediated through phononic modes in mechanical oscillator. This paradigmatic transduction experiment is bounded by theoretical efficiency with constant driving amplitudes on electromagnetic resona...

1996
Andrew B. Kahng Sudhakar Muddu

Elmore delay has been widely used to estimate the interconnect delays in the performance-driven synthesis and layout of VLSI routing topologies. For typical RLC interconnections, Elmore delay can deviate signiicantly (by up to 33% or more) from SPICE-computed delay, since it is independent of inductance. We develop an analytical delay model to incorporate inductance eeects into the delay estima...

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