The creation of a multilevel system interconnections in submicron integrated circuits makes it possible to reduce the electrical resistance conductive tracks, parasitic capacitance between conductors, and increase speed microelectronic devices. It is proposed form transverse profile current-carrying tracks multilayer metallization an isosceles trapezoid with angles at lower base equal 75–85 deg...

Development of wearable and portable electronics promotes the miniaturization energy storage devices. Microsupercapacitor (MSC) featuring in fast charging discharging rates, long cycle life, high-power density stands out from miniaturized devices, particularly for its small size adjustable structure which is easily processed to integrate with other on-chip electronics. In this review, we system...