The electromigration-induced failure in the composite solder joints consisting of 97Pb–3Sn on the chip side and 37Pb–63Sn on the substrate side was studied. The under-bump metallization ~UBM! on the chip side was 5 mm thick electroplated Cu coated on sputtered TiW/Cu and on the substrate side was electroless Ni/Au. It was observed that failure occurred in joints in a downward electron flow ~fro...

By simply supporting carbon nanotubes with a metal substrate of a redox potential lower than that of the metal ions to be reduced into nanoparticles, we have developed a facile yet versatile and effective substrate-enhanced electroless deposition (SEED) method for functionalizing nanotubes with a large variety of metal nanoparticles, including those otherwise impossible by more conventional ele...

The importance of microscopic morphological control to metal electroand electroless deposition in several emerging technologies is discussed. The use of in situ optical probes of the morphological development of deposits is described. A number of these are reviewed to describe both the potential of each method and the available literature on studies of electroand electroless deposition. Include...

The electroless deposition method was used to prepare Ni-based nanocomposite coatings, this approach represents an alternate way of having coatings on the different substrates. Most previous literatures subject and work deals with a study effect process conditions and, Bath composition microstructure at macroscale Ni-Al2O3 composite coatings. Though, step structure bath are little, present aims...

Cerium oxide (CeO2) particle reinforced Ni-B composite coating was produced by electroless method from a bath containing CeO2 particles. In the plating bath, nickel sulfate hexahydrate ((NiSO4.6H2O) used as source, dimethylamine borane ((CH3)2NHBH3) reducing agent, thiourea (CH4N2S) stabilizer and sodium acetate (CH3COONa) complexing agent. The aim of study is to investigate structural characte...

In this study we consider copper sample as a substrate under which the Electroless Ni-W-P coatings were established and successfully deposited. The three factor was taken into consideration, i.e. concentration of Nickel Sulphate, Sodium Hypophosphite Tungstate Dihydrate. Central Composite Design modelling done with help total 20 runs that conducted in design, mass deposition per unit area respo...

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...