In this paper we address the chip-level thermal simulation problem. Our work is based on some early results treating electro-thermal problems on circuit level 11, 22. The developed electro-thermal simulation package has been integrated under Cadence DFWII Opus. Due to its relatively low CPU need this package can be used as a thermal veriication tool of layouts of analog circuits. In our approac...

Electro-thermally actuated origami provides a novel method for creating 3-D systems with advanced morphing and functional capabilities. However, it is currently difficult to simulate the multi-physical behavior of such because electro-thermal actuation large folding deformations are highly interdependent. In this work, we introduce rapid multi-physics simulation framework electro-thermally that...

Nowadays, the use of agricultural wastes is a high impact research area, due fact that this kind materials can provide some interesting properties to polymer matrix. Among these materials, seed shell are with no industrial applications, so it necessary find in aim avoid pollution. The Styrene-butadiene copolymer (SBS) wide used material thermoplastic behavior. In present work, inclusion two dif...

In this research, static stresses analysis of boron nitride nano - tube reinforced composite (BNNTRC) cylinder made of poly - vinylidene fluoride (PVDF) subjected to non - axisymmetric thermo - mechanical loads and applied voltage is developed. The surrounded elastic medium is modelled by Pasternak foundation. Composite structure is modeled based on piezoelectric fiber reinforced composite (PFR...