Regulatory efforts rely on nanometrology for the development and implementation of laws regarding the incorporation of engineered nanomaterials (ENMs) into industrial and consumer products. Copper is currently one of the most common metals used in the constantly developing and expanding sector of nanotechnology. The use of copper nanoparticles in products, such as agricultural biocides, cosmeti...

A green environmental friendly process for preparing monodispersed cuprous oxide nanoparticles is reported. In this process, cuprous oxide is prepared using Cu(OH)42- as precursor and glucose as reducing agency in the presence of dispersant under ultrasonic radiation. Spherical, welldispersed Cu2O nanoparticles were obtained with the average size of 200 nm or 1.5 μm, respectively, with or witho...

Precious metal alloys enables new possibilities to tailor materials for specific optical functions. Here we present a systematic study of the effects of a nanoscale alloying on the permittivity of Au-Ag-Cu metals at 38 different atomic mixing ratios. The permittivity was measured and analyzed numerically by applying the Drude model. X-ray diffraction (XRD) revealed the face centered cubic latti...

Articles you may be interested in Mineralization and optical characterization of copper oxide nanoparticles using a high aspect ratio bio-template Photoexpansion and nano-lenslet formation in amorphous As2S3 thin films by 800 nm femtosecond laser irradiation J. Effect of cluster size of chalcogenide glass nanocolloidal solutions on the surface morphology of spin-coated amorphous films Structure...

Improving human health is the considered major concern in area of medical and agricultural sciences. It achieved by providing good supplements with balanced diet to people forms cost effective safe nano-biofortified or nano-bioengineered vegetable crop plants fight against malnutrition other various diseases. And these nano-based methodologies are involved use nanoparticles essential nutrients ...

In the past few years, the synthesis of Cu nanoparticles has attracted much attention because of its huge potential for replacing expensive nano silver inks utilized in conductive printing. A major problem in utilizing these copper nanoparticles is their inherent tendency to oxidize in ambient conditions. Recently, there have been several reports presenting various approaches which demonstrate ...

Wafer bonding is an emerging technology for fabrication of complex three-dimensional (3D) structures; particularly it enables monolithic wafer-level 3D integration of high performance, multi-function microelectronic systems. For such a 3D integrated circuits, lowtemperature wafer bonding is required to be compatible with the back-end-of-the-line processing conditions. Recently our investigation...