A novel electrochemical setup has been developed for soft x-ray absorption studies of the electronic structure of electrode materials during electrochemical cycling. In this communication we illustrate the operation of the cell with a study of the corrosion behavior of copper in aqueous NaHCO3 solution via the electrochemically induced changes of its electronic structure. This development opens...

The corrosion of bronzes was examined in the context of single-acid versus mixed-acid (as in urban acid rain) solutions. Two bi-component bronzes (copper with either 3% Sn or 7% Sn) that closely represent those of historic artifacts were immersed for five weeks in conditions designed to replicate those experienced by statues and ornaments in cities where rainfall and humidity constantly produce...

The electrochemical behavior of copper in 0.05 M HCl and 0.05 M NaCl carried out at open-circuit potential and at constant anodic potential after one hour has been investigated using electrochemical impedance spectroscopy (EIS) at 20 °C, 40 °C and 60 °C. The formation of copper chloride (CuCl) film does not protect copper from dissolution in the chloride media. The physical properties of the pa...

Azole derivatives are common inhibitors of copper corrosion due to the chemical adsorption occurring on the metal surface that gives rise to a protective film. In particular, 1,2,4-triazole performs comparable to benzotriazole, which is much more widely used, but is by no means an environmentally friendly agent. In this study, we have analyzed the adsorption of 1,2,4-triazole on copper by takin...

The corrosion behaviour of copper was studied in anoxic solutions containing different concentrations of sulphide (10–10 mol L) and chloride (0?1–5 mol L) under stagnant and controlled convective conditions. The main determinants of the structure and properties of the copper sulphide (Cu2S) films formed are the rate of sulphide transport to the surface relative to the rate of its interfacial re...

Abstract: Nickel was electrodeposited onto copper substrates with high {111} and {400} peak intensities. The grain size of coatings deposited onto the copper substrate with a higher {111} peak intensity was finer. Spheroidized pyramid morphology was obtained at low current densities on both copper substrates. By increasing the deposition current density, grain size of the coating was increased ...

Hexagonal boron nitride (hBN) is a layered material with high thermal and chemical stability ideal for ultrathin corrosion resistant coatings. Here, we report the corrosion resistance of Cu with hBN grown by chemical vapor deposition (CVD). Cyclic voltammetry measurements reveal that hBN layers inhibit Cu corrosion and oxygen reduction. We find that CVD grown hBN reduces the Cu corrosion rate b...

In the case of medical implants, foreign materials are preferential sites for bacterial adhesion and microbial contamination, which can lead to the development of prosthetic infections. Commercially biomedical TiNi shape memory alloys are the most commonly used materials for permanent implants in contact with bone and dental, and the prevention of infections of TiNi biomedical shape memory allo...

Self-assembled monolayers (SAMs) of three n-alkanethiols, 1-octadecanethiol (C18SH), 1-dodecanethiol (C12SH), and 1-hexanethiol (C6SH), were formed on fresh, oxide-free copper surfaces obtained by HNO3 etching. The corrosion protection abilities of the three alkanethiol SAMs were evaluated in 0.2 mol cm-3 NaCl, 0.2 mol cm-3 HCl and 0.2 mol dm–3 H2SO4 solutions using the electrochemical impedanc...