Large-scale photonic integration circuits (PICs) have been demonstrated on InP [1] and Si [2–5] substrates for data communications. Silicon PICs 3D integrated with electronic integrated circuits promise future high-speed and cost-effective optical interconnects to enable Exascale performance computers and datacenters [5]. For realistic intra-chip and inter-chip optical links, the bandwidth dens...

We present a system for direct parallel optical data communication between integrated circuits on neighboured printed circuit boards based on a monolithic integrated CMOS smart pixel array, fibre arrays, and VCSELs. The advantage of our system versus backplane systems is the direct data transfer through the space avoiding planar and area consuming interconnections. The detector chip allows a da...

The performance of silicon photonic components and integrated circuits has improved dramatically in recent years. As a key enabler, heterogeneous integration not only provides the optical gain which is absent from native Si substrates enables complete functionalities on chip, but also lays foundation versatile device engineering. This paper reviews progress high-performance photonics using inte...

An optimal partition between on-chip and on-board interconnects is proposed, which achieves the highest possible global clock frequency as well as high wiring density. A general model is developed for adequate number and size of repeaters and the impact of this model on optimal partition of interconnects is also studied. Using on-board wires the global clock frequency of a projected system-on-a...

This review intuitively explains the fundamental trade-offs of repeated and equalized electrical interconnects for on-chip networks as referencing counterparts of emerging nanophotonic interconnects in terms of data rate density, energy per bit, and latency. We also review the current stateof-the-art electrical interconnects from literature.

5 Damascene Process 5 History of Copper Interconnects 6 Damascene Process Steps 6 State of the Art in ECD 6 Electrochemical Deposition (ECD) 8 Basic ECD 11 V-I Curves 12 Uniformity 14 Boundary Layer 14 Conductivity 15 Bath Chemistry and Plating Waveforms 16 Superfilling 17 Morphology 17 A Look to the Future c o n t e n t s Interconnects in integrated circuits distribute clock and other signals ...

The integration of optical interconnects with silicon-based electronics can address the growing limitations facing chip-scale data transport as microprocessors become progressively faster. However, until now, material lattice mismatch and incompatible growth temperatures have fundamentally limited monolithic integration of lasers onto silicon substrates. Here, we use a novel growth scheme to ov...

Although the concept of constructing active optical waveguides in crystalline silicon has existed for over twenty years, it is only in the past few years that silicon photonics has been given serious attention as a displacing technology. Fueled by the predicted saturation of “Moore’s Law” within the next decade, universities and industries from all over the world are exploring the possibilities...

The off-chip electrical interconnects for high speed and high I/O processors have become increasingly complex and costly. Data transfer rates exceeding gigabits per second are common in high performance computer systems. A cost-effective wide-band interconnect between chips, modules, boards, backplane, frames and cabinets has become increasingly critical in the system design. This paper reviews...

As indicated in the latest version of ITRS roadmap, optical wiring is a viable interconnect technology for future SoC/SiC/SiP designs that can provide broad band data transfer rates unmatchable by the existing metal/low-k dielectric interconnects. In this paper, we present an interconnection architecture, referred as the wavelength routed optical network (WRON), suitable to build on-chip optica...