We developed a soft and high thermal conductive heat link for cryogenic applications. The measured maximum conductivity was approximately 18500 W/m/K at 10 K. This spring constant 1/43 of that single thick wire with the same cross-sectional area room temperature. realized these performances by utilizing purity aluminum (99.9999 %, 6N) stranding many thin wires are 0.15 mm in diameter. electrica...

This report makes a case for the need to examine the methodological foundations of AI. Many aspects of AI have not yet developed to a point of general agreement. The goals of AI work, the methods for acheiving these goals, the presentation of results, and the assessment of claims are all highly contentious issues. All aspects of AI methodology are subject to debate The Workshop on the Foundatio...

Problem 1. Infinite Products and Coproducts in Ab. We have seen that finite products and coproducts agree in Ab. However, the same is not true for infinite products and coproducts. Let I be a set and let {Ai}i∈I be a family of abelian groups, each equal to some fixed group A. (a) Show that the set AI := HomSet(I, A) is an abelian group. Furthermore, show that we can think of this group as the i...

Mineral deposits related to thermal springs are generally of the carbonate or silicate precipitation types. Numerous thermal waters have been studied worldwide for their extensive deposits (Italy, Iceland, New Zealand, USA). The occurrence of other deposit types, such as oxides, associated with hydrothennal activity are few. However, the almost pure manganese oxide deposit in Japan was recently...

Ni-Ti shape memory actuators respond to temperature changes with a shape change. Therefore, they are sensors and actuators. They combine large motion, rather high forces and small size, thus providing high work output. They usually consist of only a single piece of metal, e.g. a helical spring, and do not require sophisticated mechanical systems. They of len fit into tight spaces in given desig...

Bonding-pad densities on high-performance integratedcircuit chips are beginning to exceed the limits of available interconnect technologies. Also, stresses due to thermal mismatch in flip-chipped packages are reducing time to contact failure. We have addressed both of these problems by microlithographically fabricating highly elastic cantilever springs in linear arrays on pitches down to 6 μm. ...