(2001) Nonlinear analysis of plastic ball grid array solder joints. Notice: Changes introduced as a result of publishing processes such as copy-editing and formatting may not be reflected in this document. For a definitive version of this work, please refer to the published source: ABSTRACT A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder...

In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish. Samples were isothermally aged at the equivalent of 0, 2, 7 and 14 years service life. Representative solder joints were cross-sectioned and analyzed u...

This study mainly evaluated the thermo-mechanical reliability of lead-free packaging techniques for attaching large-area chip. With 3 MPa pressure, a low-temperature (<300 o C) sintering technique enabled by a nano-scale silver paste was developed for attaching 100 mm 2 silicon die. This new lead-free packaging technique for die-attachment was compared with soldering by vacuum reflow. Lead-free...

Currently, the trend of miniaturization, light weight, high speed and multifunction are common in electronic assemblies, especially, for the mobile electronics. One of the most critical aspects of the package reliability is solder joint reliability. So, in that field, thermal cycling and drop/impact are the primary requirement for solder joint reliability. This paper discusses the reliability o...

0026-2714/$ see front matter 2009 Published by doi:10.1016/j.microrel.2009.03.001 * Corresponding author. Tel.: +886 3573 1814; fax: E-mail address: [email protected] (C. Chen). Three dimensional thermo-electrical analysis was employed to simulate the current density and temperature distributions for eutectic SnAg solder bumps with shrinkage bump sizes. It was found that the current crowdin...

In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...

In a typical electronic assembly, many of the solder joints undergo multiple reflow cycles during the course of a complete manufacturing process from wafer bumping to the board level assembly. Effect of these reflows on the solder joint formation and its evolution during these cycles was investigated. In the first part of the study, small size BGA’s were assembled with 12mil spheres of a number...

Intermetallic compounds (IMCs) play a great role in solder joint reliability. Intermetallic formation was studied between SnAgSb solder and Cu substrate of a power package device. The integrity of IMC region is vital to the performance and reliability of the semiconductor packages. The solder joint of the as received packages were subjected to the thermal aging test for 50, 100, 200 and 400 hou...

Ni Bi3Ni Cu -40/250 Sn-Cu We have studied a novel high-temperature solder for mounting the power semiconductor devices used in the inverters of hybrid and fuelcell vehicles. The melting point of well-known lead-free solders such as Sn-based alloys is around 220 C, which is too low to allow their use with high-temperature compound power semiconductor devices such as those based on GaN and SiC. T...

Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper “san...