Abstract Weight reduction and improved strength are two common engineering goals in the joining sector to benefit transport, aerospace, nuclear industries amongst others. Here, this paper, we show that suitable addition of carbon nanomaterials a tin-based solder material matrix (C-Solder® supplied by Cametics Ltd.) results two-fold soldered composite joints. Single-lap shear joint experiments w...

PURPOSE The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method ...

Wafer bonding has been widely used for forming vacuum and hermetic packages for MEMS devices. Several techniques, including anodic silicon-glass, silicon-silicon fusion, metal compression, glass frit, eutectic, and solder bonding have been attempted and some have been demonstrated successfully. Solders have some advantages that make them an interesting area of research for wafer bonding. They o...

Abstract Sn-58Bi, an eutectic alloy, has been explored for use as a low-temperature lead-free solder alloy. However, the properties of Sn-Bi alloys well those their joints need to be improved significantly so that these can applicable practical use. In particular, two drawbacks addressed: intrinsic brittleness Bi and microstructure coarsening during aging. this study, Sn-Bi-Zn (SBZ) SBZ-In (SBZ...

The aim of the research work was to characterize soldering alloy type Bi-Ag-Ti and study direct silicon copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on content silver titanium. begins melt at temperature 262.5 ?C full is completed 405 ?C. microstructure consists bismuth matrix with local eutectics. crystals titanium phases as BiTi2 Bi9Ti8 are segregated in m...

The influence of Cu and Ni additions on the morphology of the intermetallic compounds (IMC) formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, pr...

Solders are used in electronic packaging for metallurgical interconnections. Thermomechanical methods to modify the properties of a material. Cubic Sn-0.7Cu solder alloy was subjected heat treatment at 30–150 °C 20 min, followed by 80 % compression. The control samples this study were only treatment. This nanoindentation approach investigate reductions modulus and hardness lead-free after therm...