نتایج جستجو برای: plasma deposition

تعداد نتایج: 439546  

Journal: :Applied Chemistry for Engineering 2014

Journal: :The Journal of neuroscience : the official journal of the Society for Neuroscience 1999
Z G Zhang M Chopp A Goussev D Lu D Morris W Tsang C Powers K L Ho

The mechanisms underlying cerebral microvascular perfusion deficit resulting from occlusion of the middle cerebral artery (MCA) require elucidation. We, therefore, tested the hypothesis that intravascular fibrin deposition in situ directly obstructs cerebral microcirculation and that local changes in type 1 plasminogen activator inhibitor (PAI-1) gene expression contribute to intravascular fibr...

Journal: :Microscopy and Microanalysis 2006

2009
W.M.M. Kessels A. Devi

Film growth by the atomic layer deposition (ALD) method relies on alternate pulsing of the precursor gases and vapors into a vacuum chamber and their subsequent chemisorption on the substrate surface (Fig. 1) [1,2]. The different steps in the process are saturative such that ALD film growth is self-limiting yielding one submonolayer of film per deposition cycle. ALD has some unique characterist...

2017
J. Salge

In plasma-assisted deposition methods the activation energy necessary for the initiation of chemical reactions is transferred via charged particles. Due to this fact in many cases the process temperature can be kept small, if gas discharges at pressures below 1 hPa are used. On the other hand low pressure requires a great deal of vacuum equipment. Processes at atmospheric pressure are more favo...

2005
Jacques Pelletier

After pioneering work in the 1980s, plasma-based ion implantation (PBII) and plasma-based ion implantation and deposition (PBIID) can now be considered mature technologies for surface modification and thin film deposition. This review starts by looking at the historical development and recalling the basic ideas of PBII. Advantages and disadvantages are compared to conventional ion beam implanta...

Journal: :Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 2004

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