نتایج جستجو برای: modified resin

تعداد نتایج: 280323  

Journal: :Journal of The Adhesion Society of Japan 2004

2015
Rafat Bagheri

ARTICLE INFO Abstract Article History: Received 2 August 2015 Accepted 2 November 2015 Statement of Problem: There is no enough published data about the shear bond strength of resin modified glass ionomer adhesives on caries-affected primary tooth dentin excavated using minimally invasive systems. Objectives: To evaluate the shear bond strength of 2 different adhesives (one resin modified glass...

Journal: :Journal of the Society of Materials Science, Japan 1967

Journal: :Journal of clinical and diagnostic research : JCDR 2013
Gaurav Patri Yoshaskam Agnihotri Saketh Rama Rao Namratha Lakshmi Sambarta Das

AIM To investigate the pulp chamber penetration of bleaching agent in intact teeth and teeth following restorative procedure. METHODOLOGY Sixty extracted human incisors were selected and divided into 6 Groups. Four Groups were restored with hybrid composite resin and resin modified glass ionomer cement respectively, while 2 Groups were left intact. The Groups were then immersed in the treatme...

2012
Tijen PAMIR Bilge Hakan ŞEN Özgür EVCIN

OBJECTIVE This study determined the effects of various surface treatment modalities on the bond strength of composite resins to glass-ionomer cements. MATERIAL AND METHODS Conventional (Ketac Molar Quick Applicap) or resin-modified (Photac Fil Quick Aplicap) glass-ionomer cements were prepared. Two-step etch-rinse & bond adhesive (Adper Single Bond 2) or single-step self-etching adhesive (Adp...

2009
Usha Mohan Das Deepak Viswanath Umme Azher

UNLABELLED Restoration of primary teeth continues to be an important facet of restorative dentistry. In comparison to restorations in permanent dentition, the longevity of those in primary teeth is significantly different for all materials. This makes the assessment of these fillings as a separate group meaningful. As there is lack of supporting clinical data with regard to the restoration of p...

Journal: :Journal of Japan Institute of Electronics Packaging 2011

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