The production and characterization of ultradense, planarized, and organized silicon nanowire arrays with good crystalline and optical properties are reported. First, alumina templates are used to grow silicon nanowires whose height, diameter, and density are easily controlled by adjusting the structural parameters of the template. Then, post-processing using standard microelectronic techniques...

The architecture of a complete image segmentation system and the development of an embedded VLSI low-power integrated circuit are reported. A neuromorphic engineering approach is adopted, with the purpose of reproducing behaviour of biological neural networks by taking advantage of the microelectronic implementation properties, especially low power consumption and reduced volume and weight. The...

Since 2004 the field of graphene research has attracted increasing interest worldwide. Especially the integration of graphene into microelectronic devices has the potential for numerous applications. Therefore, we summarize the current knowledge on this aspect. Surveys show that considerable progress was made in the field of graphene synthesis. However, the central issue consists of the availab...

Wireless sensor networks have emerged in the past decade as a result of recent advances in microelectronic system fabrication, wireless communications, integrated circuit technologies, microprocessor hardware and nano-technology, progress in adhoc networking routing protocols, distributed signal processing, pervasive computing and embedded systems. As routing protocols are application specific,...

Gait analysis measurement is a method to assess and identify gait events and the measurements of dynamic, motion and pressure parameters involving the lowest part of the body. This significant analysis is widely used in sports, rehabilitation as well as other health diagnostic towards improving the quality of life. This paper presents a new system empowered by Inertia Measurement Unit (IMU), ul...

Abstract The emergence of topological insulators (TIs) raised high expectations for their application in quantum computers and spintronics. Being bulk semiconductors, nontrivial topology at the electronic bandgap enables dissipation-free charge spin transport protected metallic surface states. For application, crystalline thin films are requested sufficient quantity. A suitable approach is liqu...

Aluminum nitride (AlN) thin films have potential applications in microelectronic and optoelectronic devices. In this study, AlN thin films with different thicknesses were deposited on silicon substrate by single ion beam sputtering method. The X-ray diffraction (XRD) spectra revealed that the structure of films with thickness of - nm was amorphous, while the polycrystalline hexagonal AlN with a...

t is exciting to be a microelectronic systems educator considering the enormous impact of microelectronic engineers on a wide range of human endeavors. MSE fills a critical niche in enabling microelectronic systems educators to share in this excitement and exchange ideas on how to best prepare future microelectronics engineers. We challenge each other and our students to ever greater contributi...

The miniaturization and three dimensional die stacking in advanced microelectronic packages poses a big challenge to their non-destructive evaluation by acoustic micro imaging. In particular, their complicated structures and multiple interfaces make the interpretation of acoustic data even more difficult. A common phenomenon observed in acoustic micro imaging of microelectronic packages is the ...

The thermomechanical warpage or vertical deflection of microelectronic packages due to temperature change is caused by the mismatch in the coefficients of thermal expansion between vertically asymmetric layers of materials. The structure of many microelectronic packages may be characterized as a multi-layered plate consisting of two regions, that of a die area and a mold area. Physical observat...