نتایج جستجو برای: long term creep
تعداد نتایج: 1000621 فیلتر نتایج به سال:
Journal:
:Shigen-to-Sozai
1992
Journal:
:Materials Science and Technology
2011
Journal:
:Polymer Testing
2021
Journal:
:Journal of the Society of Materials Science, Japan
1992
Journal:
:Tetsu-to-Hagane
1991
Journal:
:JOURNAL OF CIVIL ENGINEERING AND MANAGEMENT
2017
Journal:
:Journal of the Society of Materials Science, Japan
2020
2011
Yongchang Lee
Cemal Basaran
Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly used creep models are compared with the...
Journal:
:International Journal of Solids and Structures
2014
نمودار تعداد نتایج جستجو در هر سال
با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید