P. Pokorny, J. Kolisko, L. Balik – Czech Technical University – Klokner Institute, Prague, Czech Republic P. Novak – Institute of Chemical Technology, Prague, Czech Republic This review article mainly describes the composition of intermetallic Fe Zn, i.e. zeta (ζ), delta (δ1k + δ1p), gamma1 (Γ1) and gamma (Γ) on galvanized steel during low temperature galvanization (t ~ 450 °C). It gives detail...

Tin whisker growth is a serious reliability concern for electronics using high-density packaging. Whisker growth behavior of tin lead eutectic solders doped with different neodymium concentration (5–0.1wt.%) was studied in present work. Results indicate that the Nd in the all of the Sn–Pb–Nd alloys mainly exists in NdSn3 intermetallic compound, and that the distribution of the NdSn3 phase is ve...

We introduced a continuum method for modeling of intermediate phase growth and numerically simulated three common experimental situations relevant to the physical metallurgy of soldering: growth of intermetallic compound layer from an unlimited amount of liquid and solid solders and growth of the compound from limited amounts of liquid solder. We found qualitative agreements with the experiment...