Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn–Ag–Cu solder powder and the interfacial morphology of the solder and flexible BGA substrates were characterized metallographically. At their interfaces, different types of scallop-shaped intermetallic compound layers such as ...

Intermetallide phase formation was studied in a powdered Fe–Al system under layer by layer laser cladding with the aim of fabricating the gradient of properties by means of changing the Fe–Al concentration ratio in the powder mixture from layer to layer. The relationships between the laser cladding parameters and the intermetallic phase structures in the consecutively cladded layers were determ...

Intermetallic compounds containing transition metals and sp elements often form a gap at the Fermi energy due to hybridization. This gap can be exploited for applications, making these compounds the subject of intense study. For example, intermetallic semiconductors are attractive for use in thermoelectric devices due to their typically small gaps and large Seebeck coefficients (ex. ZrNiSn) [1]...

Although metal-metal bonding is important in the chemistry of both solid-state intermetallic compounds and molecular species, the study of this bonding is limited by the compounds available and it is rarely possible to identify connections between these two areas. In this study, molecular intermetalloids [Ln(ReCp(2))(3)] (Ln = Sm, Lu and La) have been synthesized that contain lanthanoid metals ...

New Mg-3Zn-2Ca magnesium alloy was prepared using different processing techniques: gravity casting as well as squeeze casting in liquid and semisolid states. Materials were further thermally treated; thermal treatment of the gravity cast alloy was additionally combined with the equal channel angular pressing (ECAP). Alloy processed by the squeeze casting in liquid as well as in semisolid state ...

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present ...

The results of a thorough structural study of crystalline intermetallic compounds within the Al-Li-(Cu,Mg,Zn) system are given. Characteristic morphologies of these ternary or quaternary phases are exhibited by concentrated alloys or large single crystals. Typical X-ray powder diffraction data, selected area electron diffraction patterns and high resolution electron microscopy images are shown,...