Direct wafer bonding has been identified as an enabling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need to understand the factors that lead to bonding failure. Bonding relies on shortranged surface forces, thus flatness deviations of the wafers may prevent bonding. Bonding succe...

Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex processes for the interconnection of metal wires. This paper presents a novel Au/Si eutectic wafer bonding structure and an implementation method...

AIM: The aim of this study was to compare the shear bond strength of two techniques for bonding lingual orthodontic retainer; the chairside modified bonding technique introduced by Al-Emran and Hashim, and the chairside manual bonding technique currently used in orthodontic practice. MATERIALS AND METHODS: Sixty-four extracted cariesfree premolars were divided into two equal groups. Group A rep...

AIM The process of bonding orthodontic appliances to the enamel surface of the teeth has come to the forefront as a major improvement in bonding techniques. The purpose of this study is to compare the shear bond strength of stainless steel orthodontic brackets bonded using conventional direct bonding and indirect bonding as described by Thomas. MATERIALS AND METHODS Forty sound human premolar...

molecules to evolve in the test tube. With the discovery of catalytic RNA, and advances in nucleic acid amplification techniques such as the polymerase chain reaction, it became possible to construct laboratory systems that allow the Darwinian evolution of functional RNA (and later DNA) molecules. This is not evolution based on natural selection, but rather directed evolution based on selection...