This study numerically investigated heat transfer and fluid flow characteristics in a novel cylindrical heat sink with helical minichannels for the laminar flow of fluid with temperature-dependent properties. A finite volume method was employed to obtain the solution of governing equations. The effects of helical angle, channel aspect ratio, and Reynolds number, which were regarded as main para...

the fluid flow and heat transfer in lid-driven enclosures filled with cu-water nanofluid is numerically investigated. the moving vertical walls of the enclosure  are maintained in a constant temperature, while the horizontal walls are insulated. the hybrid scheme is used to discretize the convection terms and simpler algorithm is adopted to couple the velocity field and pressure in the momentum...

Recent process developments have permitted the highly anisotropic bulk micromachining of titanium microelectromechanical systems (MEMS). By using the metal anisotropic reactive ion etching with oxidation (MARIO) process, arbitrarily high-aspect-ratio structures with straight sidewalls and micrometre-scale features have been bulk micromachined into titanium substrates of various thicknesses, ran...

What are they? In human health it is generally the case that the more people studied, and the longer the surveillance of them, the greater the number of new occurrences of any specified condition there are likely to be. This is because of the increase in total time ‘at risk’ of having an event, that is, the increased persons-and-time of observation. A rate is an arithmetic way of quantifying th...

Copper electrodeposition in high-aspect-ratio through-holes micromachined by deep reactive ion etching is one of the most essential processes for fabricating through-wafer interconnects, which will be used in developing future generation high-speed, compact 3D microelectronic devices. Although copper electrodeposition is a well-established process, completely void-free electroplating in very de...