The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

Abstract This study takes lead-zinc flotation tailings as the research object. The process of “tailings regrinding-lead-zinc mixed floatation-activation zinc separation” is used to comprehensively recover valuable metal elements from original tailings. results show that grinding fineness -74 μm under condition m accounts for 82%; recovery rates lead and in concentrate obtained open-circuit test...

Surface roughness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system. The subject of this paper is a grinding process performed on P20 tool steel by changing the grinding conditions, including the depth of cut, the grinding passes, the type of wheel, and the cutting fluid supply in the experiment. The mai...

The quality and economy of grinding depend on proper selection of grinding conditions for the materials to be ground. In order to evaluate the effect of heavy-duty grinding, a new performance index, which includes specific material removal rate, size accuracy, and grinding forces, was proposed. Robust design of experiment, including orthogonal arrays, the signal-to-noise ratio (SNR) method, and...

A simple and effective solution to the robot grinding problem is introduced, which significantly reduces vibrations during grinding without additional actuators or active control. The objective is to determine the optimal compliance design for grinding robot tool holders. Specifically, the tool holder design should improve accuracy and productivity while protecting the robot arm from the large ...

In this investigation, experiments were carried out to understand the influence of various grinding parameters like wheel speed, workspeed and depth of cut on the grinding temperature at the surface of the Al-SiCP composite workpiece with different grinding wheels. The temperature distribution within the workpiece was studied by simulating the grinding process and using finite element analysis ...

The application of emulsion for combined heat extraction and lubrication requires continuous monitoring of the quality of emulsion to sustain a desired grinding environment; this is applicable to other grinding fluids as well. Thus to sustain a controlled grinding environment, it is necessary to adopt an effectively lubricated wheel-work interface. The current study was undertaken to assess exp...

Silicon wafers are used as substrates to build more than 90% of integrated circuits. One of the manufacturing processes for silicon wafers is grinding. This paper reports the investigations of silicon wafer grinding using Finite Element Analysis (FEA). FEA models are first used to study the effects of process parameters on waviness reduction in the grinding of wire-sawn wafers on a rigid chuck....

This paper presents a detailed manufacturing model that can be used for grinding a ball-end mill using 5-axis CNC (computer numerical controlled) grinding machine. The profile of the helical groove can be calculated exactly using the given wheel profile and relative movements between the workpiece and the grinding wheel. The proposed model is related to some analytical, differential geometry an...

In this work, grinding or microcutting tools in the form of pellets were manufactured using a bounded alumina abrasive grains. The bound used is a vitreous material containing quartz feldspars, kaolinite and a quantity of hematite. The pellets were used in glass grinding process to replace the free abrasive grains lapping process. The study of the elaborated pellets were done to define their ef...