An etch resistance phase was found in dental silver amalgam when the amalgam was examined metallographically. This phase was common to the silver alloy ingot as well as to its prepared amalgam. Qualitative electron microprobe technics were used to identify this phase. Quantitative electron microprobe analysis defined it as the R' phase of the copper-tin system or the intermetallic compound Cu6Sn5.

The catalytic effect of copper in Devarda’s Al-Cu-Zn alloy (Dev. alloy) and sole metallic copper, salts oxides the coaction NaBH4 within hydrodehalogenation (HDH) polybrominated phenols, such as herbicide Bromoxynil alkaline aqueous solution has been investigated. Namely, hydrodebromination (HDB) activity Dev. alloy/NaOH system compared to heterogeneous Cu-based catalysts using a reductant. Dif...

Synonyms, trade names and molecular formulae for cadmium, cadmium–copper alloy, and some cadmium compounds are presented in Table 1.1. The cadmium compounds shown are those for which data on carcinogenicity or mutagenicity were available or which are commercially important compounds. It is not an exhaustive list, and does not necessarily include all of the most commercially important cadmium-co...

An anti-galvanic replacement reaction (AGRR) of copper(II) ions reduced by ultra-small ssDNA-templated silver nanoclusters forming Ag-Cu alloy nanoparticles was observed. The reaction is against the classic galvanic theory and was monitored sensitively by the light-scattering technique.

Articles you may be interested in Shock-induced plasticity and the Hugoniot elastic limit in copper nano films and rods Uniaxial tension-induced breaking in the gold nanowire with the influence of defects and temperatures A constitutive model for a uranium-niobium alloy

The experimental facts on the stabilisation of martensite in copper base shape memory alloys, of interest to the scientific investigator and the practical alloy processor and user are reported. Factors that have an influence on stabilisation are considered in this respect. The mechanisms proposed in the literature to explain stabilisation are critically examined.

In this paper, we have design MEMS module based on thermal expansion using COMSOL Multiphysics. This device thermally expands when it is subjected to temperature. Beryllium copper alloy is used as material for this device. The expansion is measured in-terms of displacement.

Wetting of real engineering surfaces occurs in many industrial applications (liquid coating, lubrication, printing, painting...). Forced and natural wetting can be beneficial in many cases, providing lubrication and therefore reducing friction and wear. However the wettability of surfaces can be strongly affected by surface roughness. This influence can be very significant for static and dynami...

This study evaluated the shear bond strength, failure modes, and confocal microscopy of two different amalgam alloy restorations lined with five adhesive systems. Two regular-set high-copper dental amalgam alloys, Amalcap Plus and Valiant Ph.D, and five commercially available adhesive systems were selected. One hundred and twenty freshly-extracted human third molars were used for the study. The...

Synonyms, trade names and molecular formulae for cadmium, cadmium–copper alloy, and some cadmium compounds are presented in Table 1.1. The cadmium compounds shown are those for which data on carcinogenicity or mutagenicity were available or which are commercially important compounds. It is not an exhaustive list, and does not necessarily include all of the most commercially important cadmium-co...