The design, materials, process, and fabrication of a hybrid substrate for the heterogeneous integration chips with 50μm-pitch (minimum) by fan-out chip-last panel-level packaging are presented. consists fine metal linewidth (L), spacing (S), thickness (H) RDL (redistribution-layer) substrate, solder joints underfill, build-up package substrate. dielectric material L/S/H RDL-substrate is an Ajin...