The effects of different bonding parameters, such as temperature, pressure, curing time, bonding temperature ramp and post-processing, on the electrical performance and the adhesive strengths of anisotropic conductive film (ACF) interconnection are investigated. The test results show that the contact resistances change slightly, but the adhesive strengths increase with the bonding temperature i...

A method for binding a tough double-network (DN) hydrogel and a porous solid via the double network principle is proposed. The effects of the pore size of the solids and the structure of the DN gel in the pores on the bonding strength are investigated by a peeling test. Porous solids with pore sizes of the order of several micrometers afford strong gel–substrate interfaces. Under optimized cond...

Bonding of high purity polished copper was investigated using the Spark Plasma Sintering technique (SPS) showing the effect of SPS parameters (surface roughness, time, temperature and pressure) on the bonding strength behaviour. Mechanical characterization of the bonded samples was performed at room temperature using tensile test. Two surfaces roughnesses were studied (un-polished and polished ...

We developed room-temperature bonding of micro-nanofluidic device using fluorine induced plasma activation method. Fluorine was induced by O2 reactive ion etching (RIE) plasma treatment with Teflon Pieces which increased the bonding strength between fused silica glass substrates. The room-temperature bonded fused silica glass micro-nanofluidic device had high bonding strength as well as could w...

Silicon fusion bonding is studied as an enabling technology for the fabrication of microrobotic mechanisms. The e!ects of both surface activation technique and annealing temperature on bond strength are considered using a crack-opening technique. As part of the study, the relationship between patterned silicon feature size and the resulting bond strength is explored. Based on the experimental r...

BACKGROUND This in vitro study is intended to compare the shear bond strength of recent self-etching primers to superficial, intermediate, and deep dentin levels. MATERIALS AND METHODS All teeth were sectioned at various levels and grouped randomly into two experimental groups and two control groups having three subgroups. The experimental groups consisted of two different dentin bonding syst...

AIM To find an alternative to popular orthodontic bonding agent composite resin and elimination of acid etching. To assess GC Fuji Ortho as an orthodontic bonding agent under different enamel conditions and evaluate the shear bond strength. Enamel surfaces intentionally contaminated with saliva, conditioned enamel using Fuji dentin conditioner and conventional 37% phosphoric acid/60 seconds. To...