The use of electrically conductive adhesives as interconnection materials in electronic assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip joining technique using conductive adhesives has been identi®ed as a key technology for future electronics assembly and manufacturing. The purpose of the present work is to investigate optimum conditions to achieve ...

Synovial chondromatosis is a rare benign lesion originating from the synovial membrane. It presents as adhesive or non-adhesive intra-articular cartilaginous loose bodies. Although the causes of synovial chondromatosis have not been fully elucidated, inflammation, external injury, or excessive use of joints have been suggested as possible causes. Synovial chondromatosis has been reported to occ...

This paper is concerned with a fatigue study of composite adhesive lap joints produced from a bi-directional woven E-glass fibres and polypropylene. The adhesive used was a Bostik 7452 (Rubber & Plastics Grade) ethyl cyanoacrylate type. The effects of layer orientation, lap joint length and water immersion on the fatigue behaviour were studied. The specimens were immersed in water during period...

The complex problems of predicting adhesive bond strength for both adhesive and cohesive defects have been studied usinq an ultrasonic, experimental test bed system. This experimental test bed incorporates the ultrasonic and computer equipment necessary to acquire and process data from various types of adhesively bonded test specimens. The computer hardware and software have been developed to a...

Dynamic response of single lap joints, subjected to a harmonic peeling load is studied theoretically and experimentally. In the theoretical part, dynamic response of a single lap joint clamped at one end and subjected to a harmonic peeling load at the other end is investigated. Adherents are modeled as Euler-Bernouli beams joined in the lap area by a viscoelastic adhesive layer. Both axial and ...

In this work, a model based on the combination of two approaches XFEM and CZM, has been used to predict damage repairs by composite patch (patch/adhesive/plate assembly). This degradation is analyzed in terms adhesive considering both initiation propagation interfacial debonding. The cohesive zone patch/adhesive/plate system defined its properties resistance debonding estimated from displacemen...

This paper focuses on an experimental study of the explosive decompression representative samples hyperbaric type IV hydrogen storage vessels. The adhesion composite to liner is achieved by different adhesives. bond behavior liner-to-composite bonded joint considerably depends properties adhesives, as well assembly process. X-ray tomography allows determining damages before and after tests. Tom...